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Proceedings Papers

Enhancement of Mass and Heat Transfer Using Herringbone-Inspired Microstructures for Application in Microfluidic Redox Flow Cells

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Julian Marschewski, Patrick Ruch, Bruno Michel, Dimos Poulikakos
Proc. ASME. ICNMM2016, ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A001, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2016-7920
https://doi.org/10.1115/ICNMM2016-7920
View Paper titled, Enhancement of Mass and Heat Transfer Using Herringbone-Inspired Microstructures for Application in Microfluidic Redox Flow Cells
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Topics: Flow (Dynamics), Heat transfer, Microfluidics, Diffusion (Physics), Boundary layers, Chemical reactions, Coolants, Cooling, Dimensions, Electrolytes
Proceedings Papers

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

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Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48690
https://doi.org/10.1115/IPACK2015-48690
View Paper titled, Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
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Topics: Cavities, Cooling, Design, Integrated circuits, Fluids, Pressure, Blocks (Building materials), Computer simulation, Construction, Drainage
Journal Articles

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

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Yassir Madhour, Brian P. d'Entremont, Jackson Braz Marcinichen, Bruno Michel, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021006.
Paper No: EP-13-1080
https://doi.org/10.1115/1.4027436
Published Online: April 29, 2014
View Articletitled, Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks
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Topics: Flow (Dynamics), Heat, Stress, Vapors, Heat flux, Temperature, Heat transfer
Proceedings Papers

Hot Water Cooled Electronics for High Exergetic Utility

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Severin Zimmermann, Manish K. Tiwari, Ingmar Meijer, Bruno Michel, Dimos Poulikakos
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 373-380, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58432
https://doi.org/10.1115/HT2012-58432
View Paper titled, Hot Water Cooled Electronics for High Exergetic Utility
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Topics: Electronics, Hot water, Heat sinks, Cooling, Data centers, Coolants, Heat, Temperature, Engineering prototypes, Manifolds
Journal Articles

Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

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Javier V. Goicochea, Ming Hu, Bruno Michel, Dimos Poulikakos
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2011, 133(8): 082401.
https://doi.org/10.1115/1.4003533
Published Online: April 26, 2011
View Articletitled, Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces
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Topics: Atoms, Electrical conductance, Heat, Heat transfer, Quartz, Thermal conductivity, Water, Simulation, Chain, Hydrophilicity
Proceedings Papers

Direct Waste Heat Utilization From Liquid-Cooled Supercomputers

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Thomas Brunschwiler, Gerhard Ingmar Meijer, Stephan Paredes, Werner Escher, Bruno Michel
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 8, 429-440, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23352
https://doi.org/10.1115/IHTC14-23352
View Paper titled, Direct Waste Heat Utilization From Liquid-Cooled Supercomputers
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Topics: Carbon, Carbon dioxide, Climate, Cold climates, Combustion, Coolants, Cooling, Emissions, Energy budget (Physics), Flow (Dynamics)
Proceedings Papers

Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

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Ming Hu, Javier V. Goicochea, Bruno Michel, Dimos Poulikakos
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 791-796, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22362
https://doi.org/10.1115/IHTC14-22362
View Paper titled, Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces
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Topics: Atoms, Chain, Columns (Structural), Energy dissipation, Fluids, Heat, Heat flux, Heat transfer, Hydrophilicity, Molecular dynamics
Proceedings Papers

3D Integrated Water Cooling of a Composite Multilayer Stack of Chips

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Fabio Alfieri, Manish K. Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 565-574, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22813
https://doi.org/10.1115/IHTC14-22813
View Paper titled, 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips
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Topics: Composite materials, Cooling, Water, Heat transfer, Heat, Modeling, Porous materials, Temperature, Computational fluid dynamics, Fins
Journal Articles

3D Integrated Water Cooling of a Composite Multilayer Stack of Chips

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Fabio Alfieri, Manish K. Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2010, 132(12): 121402.
https://doi.org/10.1115/1.4002287
Published Online: September 22, 2010
View Articletitled, 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips
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Topics: Cooling, Flow (Dynamics), Fluids, Heat, Heat transfer, Materials properties, Porous materials, Temperature, Water, Simulation
Proceedings Papers

Progress in the Development of J Estimation Schemes for the RSE-M Code

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Patrick Le Delliou, Jean-Philippe Sermage, Pierre Cambefort, Bruno Barthelet, Philippe Gilles, Bruno Michel
Proc. ASME. ICONE10, 10th International Conference on Nuclear Engineering, Volume 1, 771-778, April 14–18, 2002
Publisher: American Society of Mechanical Engineers
Paper No: ICONE10-22691
https://doi.org/10.1115/ICONE10-22691
View Paper titled, Progress in the Development of J Estimation Schemes for the RSE-M Code
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Topics: In-service inspection, Pipes, Power stations, Pressure, Pressurized water reactors, Shells, Stress, Surface cracks, Torsion
Proceedings Papers

Recent Advances for J Simplified Assessment in RSE-M Code

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Bruno Michel, Jean-Philippe Sermage, Philippe Gilles, Bruno Barthelet, Patrick Le Delliou
Proc. ASME. PVP2003, Fatigue, Fracture, and Damage Analysis, 29-36, July 20–24, 2003
Publisher: American Society of Mechanical Engineers
Paper No: PVP2003-1986
https://doi.org/10.1115/PVP2003-1986
View Paper titled, Recent Advances for J Simplified Assessment in RSE-M Code
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Topics: Fracture (Materials), In-service inspection, Junctions, Pipes, Power stations, Pressure, Pressurized water reactors, Shells, Stress