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Brian P. d'Entremont
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Proceedings Papers

A Numerical Study of Pulsating Heat Pipe Performance

Brian P. d’Entremont, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48350
https://doi.org/10.1115/IPACK2015-48350
View Paper titled, A Numerical Study of Pulsating Heat Pipe Performance
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Topics: Heat pipes, Slug flows, Boiling, Condensation, Evaporation, Microchannels, Buoyancy, Condensers (steam plant), Flow (Dynamics), Heat transfer
Journal Articles

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Yassir Madhour, Brian P. d'Entremont, Jackson Braz Marcinichen, Bruno Michel, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021006.
Paper No: EP-13-1080
https://doi.org/10.1115/1.4027436
Published Online: April 29, 2014
View Article titled, Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks
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Topics: Flow (Dynamics), Heat, Stress, Vapors, Heat flux, Temperature, Heat transfer
Proceedings Papers

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73276
https://doi.org/10.1115/IPACK2013-73276
View Paper titled, Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling
Open the PDF for Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling in another window
Topics: Microchannels, Thermal management, Thermoelectric cooling, Cooling, Thermoelectric coolers, Heat, Computer simulation, Currents, Design, Electric current