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Ben-Je Lwo
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Journal Articles

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

Ben-Je Lwo, Kuo-Hao Tseng, Kun-Fu Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2016, 138(2): 024501.
Paper No: EP-15-1073
https://doi.org/10.1115/1.4032932
Published Online: March 23, 2016
View Article titled, A Study on Electrical Reliability Criterion on Through Silicon Via Packaging
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Topics: Failure, Packaging, Reliability, Silicon
Journal Articles

Parameter Calibrations on MOSFET Stress Sensors

Ren-Tzung Tan, Hsien Chung, Ben-Je Lwo, Chun-Pai Tang, Kun-Fu Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031004.
https://doi.org/10.1115/1.4006888
Published Online: July 18, 2012
View Article titled, Parameter Calibrations on MOSFET Stress Sensors
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Topics: Calibration, MOSFET transistors, Sensors, Stress, Temperature
Journal Articles

In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

Ben-Je Lwo, Jeng-Shian Su, Hsien Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031003.
https://doi.org/10.1115/1.3144149
Published Online: June 23, 2009
View Article titled, In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors
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Topics: Sensors, Simulation, Stress, Temperature, Packaging, Finite element analysis, Temperature sensors
Journal Articles

Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

Ben-Je Lwo, Mem. ASME, Shen-Yu Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 289–293.
https://doi.org/10.1115/1.1572904
Published Online: June 10, 2003
View Article titled, Calibrate Piezoresistive Stress Sensors Through the Assembled Structure
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Topics: Calibration, Sensors, Stress, Temperature
Journal Articles

In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

Ben-Je Lwo, Tung-Sheng Chen, Ching-Hsing Kao, Yu-Lin Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 115–121.
https://doi.org/10.1115/1.1452244
Published Online: May 2, 2002
View Article titled, In-Plane Packaging Stress Measurements Through Piezoresistive Sensors
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Topics: Packaging, Sensors, Stress, Calibration, Temperature
Journal Articles

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

Ben-Je Lwo, Ching-Hsing Kao, Tung-Sheng Chen, Yao-Shing Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 22–26.
https://doi.org/10.1115/1.1414134
Published Online: February 21, 2000
View Article titled, On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging
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Topics: Calibration, Sensors, Stress, Temperature, Manufacturing, Microelectronic packaging
Journal Articles

Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

Ben-Je Lwo, Kun-Fu Tseng, Ching-Hsing Kao, Luke Su Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 42–47.
https://doi.org/10.1115/1.483130
Published Online: August 13, 1999
View Article titled, Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model
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Topics: Steady state, Temperature, Transients (Dynamics), Circuits, Convection