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Journal Articles

Orientation Effects in Two-Phase Microgap Flow

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Franklin L. Robinson, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031009.
Paper No: EP-19-1009
https://doi.org/10.1115/1.4043483
Published Online: May 17, 2019
View Articletitled, Orientation Effects in Two-Phase Microgap Flow
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Topics: Boiling, Flow (Dynamics), Gravity (Force), Heat flux
Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

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Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8383
https://doi.org/10.1115/IPACK2018-8383
View Paper titled, Orientation Effects in Two-Phase Microgap Flow
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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

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David C. Deisenroth, Avram Bar-Cohen, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A025, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74287
https://doi.org/10.1115/IPACK2017-74287
View Paper titled, Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel
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Topics: Geometry, Two-phase flow, Cooling, Heat, Boiling, Evaporation, Flow (Dynamics), Manifolds, Cooling systems, Design
Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

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Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010909.
Paper No: EP-15-1097
https://doi.org/10.1115/1.4032348
Published Online: March 11, 2016
View Articletitled, Modeling Thermal Microspreading Resistance in Via Arrays
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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model
Proceedings Papers

Review of Most Recent Progress on Development of Polymer Heat Exchangers for Thermal Management Applications

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David C. Deisenroth, Martinus Adrian Arie, Serguei Dessiatoun, Amir Shooshtari, Michael Ohadi, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48637
https://doi.org/10.1115/IPACK2015-48637
View Paper titled, Review of Most Recent Progress on Development of Polymer Heat Exchangers for Thermal Management Applications
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Topics: Heat exchangers, Polymers, Thermal management, Additive manufacturing, Corrosion protection, Electrical conductivity, Heat transfer, Manufacturing, Stability, Temperature
Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

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Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48422
https://doi.org/10.1115/IPACK2015-48422
View Paper titled, Modeling Thermal Spreading Resistance in Via Arrays
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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux
Proceedings Papers

Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization

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Caleb Serafy, Ankur Srivastava, Avram Bar-Cohen, Donald Yeung
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A035, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48344
https://doi.org/10.1115/IPACK2015-48344
View Paper titled, Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization
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Topics: Design, Microfluidics, Optimization, Cooling, Energy efficiency, Circuits
Proceedings Papers

Thermally-Optimum Design of GaN-on-SiC HEMT

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Caleb A. Holloway, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A052, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48119
https://doi.org/10.1115/IPACK2015-48119
View Paper titled, Thermally-Optimum Design of GaN-on-SiC HEMT
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Topics: Design, Gallium nitride, Temperature, Geometry, Heat, Interfacial thermal resistance, Junctions, Thermal resistance, Cooling, Dimensions
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

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Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48334
https://doi.org/10.1115/IPACK2015-48334
View Paper titled, Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

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Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040803.
Paper No: EP-15-1063
https://doi.org/10.1115/1.4031602
Published Online: October 9, 2015
View Articletitled, Nanothermal Interface Materials: Technology Review and Recent Results
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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing
Proceedings Papers

Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube

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Darin J. Sharar, Arthur E. Bergles, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T03A016, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-22029
https://doi.org/10.1115/ICNMM2014-22029
View Paper titled, Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube
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Topics: Two-phase flow, Flow (Dynamics), Film thickness
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

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Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
View Articletitled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

Energy Efficient Two-Phase Microcooler Design for a Concentrated Photovoltaic Triple Junction Cell

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Alexander Reeser, Peng Wang, Gad Hetsroni, Avram Bar-Cohen
Journal: Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Research-Article
J. Sol. Energy Eng. August 2014, 136(3): 031015.
Paper No: SOL-13-1011
https://doi.org/10.1115/1.4027422
Published Online: May 2, 2014
View Articletitled, Energy Efficient Two-Phase Microcooler Design for a Concentrated Photovoltaic Triple Junction Cell
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Topics: Cooling, Flow (Dynamics), Microcoolers, Pressure drop, Temperature, Solar energy, Heat transfer coefficients, Junctions, Design, Solar cells
Proceedings Papers

Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot

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Michael Manno, Peng Wang, Avram Bar-Cohen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A038, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73186
https://doi.org/10.1115/IPACK2013-73186
View Paper titled, Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot
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Topics: Cooling, Germanium, Thermoelectric cooling, Transients (Dynamics)
Proceedings Papers

Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes

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Darin J. Sharar, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A042, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73199
https://doi.org/10.1115/IPACK2013-73199
View Paper titled, Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes
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Topics: Flow (Dynamics), Heat transfer
Journal Articles

Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm

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Avram Bar-Cohen
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Expert View
J. Nanotechnol. Eng. Med. May 2013, 4(2): 020907.
Paper No: NANO-12-1130
https://doi.org/10.1115/1.4023898
Published Online: July 23, 2013
View Articletitled, Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm
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Topics: Cooling, Thermal management, Microchannels
Proceedings Papers

Quantum-Well Si/SiC Self-Cooling for Thermal Management of High Heat Flux GaN HEMT Semiconductor Devices

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Peng Wang, Michael Manno, Avram Bar-Cohen
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 615-624, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75290
https://doi.org/10.1115/MNHMT2012-75290
View Paper titled, Quantum-Well Si/SiC Self-Cooling for Thermal Management of High Heat Flux GaN HEMT Semiconductor Devices
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Topics: Cooling, Gallium nitride, Heat flux, Quantum wells, Semiconductor devices, Thermal management, Wide band gap semiconductors, Electric current, Electron mobility, Integrated circuits
Journal Articles

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

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Peng Wang, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021001.
Paper No: EP-12-1012
https://doi.org/10.1115/1.4023215
Published Online: March 28, 2013
View Articletitled, Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
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Topics: Cooling, Flow (Dynamics), Fluids, Heat transfer coefficients, Temperature, Vapors, Thermal resistance, Pressure drop, Thermal management
Proceedings Papers

Modeling and Validation of a Prototype Thermally-Enhanced Polymer Heat Exchanger

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Frank Robinson, Juan G. Cevallos, Avram Bar-Cohen, Hugh Bruck
Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 597-606, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65684
https://doi.org/10.1115/IMECE2011-65684
View Paper titled, Modeling and Validation of a Prototype Thermally-Enhanced Polymer Heat Exchanger
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Topics: Engineering prototypes, Heat exchangers, Modeling, Polymers, Heat transfer, Fluid pressure, Polymer composites, Stress, Titanium, Anisotropy
Proceedings Papers

Polymer Heat Exchangers: An Enabling Technology for Water and Energy Savings

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Juan G. Cevallos, Frank Robinson, Avram Bar-Cohen, Hugh Bruck
Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 607-619, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65708
https://doi.org/10.1115/IMECE2011-65708
View Paper titled, Polymer Heat Exchangers: An Enabling Technology for Water and Energy Savings
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Topics: Heat exchangers, Polymers, Water, Seawater, Cooling, Composite materials, Coolants, Polymer composites, Corrosion, Corrosion resistance