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Journal Articles

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen

J. Electron. Packag. September 2019, 141(3): 031009.

Paper No: EP-19-1009

DOI: https://doi.org/10.1115/1.4043483

Published Online: May 17, 2019

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Topics: Boiling, Flow (Dynamics), Gravity (Force), Heat flux

Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018

Paper No: IPACK2018-8383

DOI: https://doi.org/10.1115/IPACK2018-8383

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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration

Proceedings Papers

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

David C. Deisenroth, Avram Bar-Cohen, Michael Ohadi

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A025, August 29–September 1, 2017

Paper No: IPACK2017-74287

DOI: https://doi.org/10.1115/IPACK2017-74287

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Topics: Geometry, Two-phase flow, Cooling, Heat, Boiling, Evaporation, Flow (Dynamics), Manifolds, Cooling systems, Design

Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen

J. Electron. Packag. March 2016, 138(1): 010909.

Paper No: EP-15-1097

DOI: https://doi.org/10.1115/1.4032348

Published Online: March 11, 2016

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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model

Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015

Paper No: IPACK2015-48334

DOI: https://doi.org/10.1115/IPACK2015-48334

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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride

Proceedings Papers

Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization

Caleb Serafy, Ankur Srivastava, Avram Bar-Cohen, Donald Yeung

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A035, July 6–9, 2015

Paper No: IPACK2015-48344

DOI: https://doi.org/10.1115/IPACK2015-48344

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Topics: Design, Microfluidics, Optimization, Cooling, Energy efficiency, Circuits

Proceedings Papers

Thermally-Optimum Design of GaN-on-SiC HEMT

Caleb A. Holloway, Avram Bar-Cohen

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A052, July 6–9, 2015

Paper No: IPACK2015-48119

DOI: https://doi.org/10.1115/IPACK2015-48119

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Topics: Design, Gallium nitride, Temperature, Geometry, Heat, Interfacial thermal resistance, Junctions, Thermal resistance, Cooling, Dimensions

Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015

Paper No: IPACK2015-48422

DOI: https://doi.org/10.1115/IPACK2015-48422

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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux

Proceedings Papers

Review of Most Recent Progress on Development of Polymer Heat Exchangers for Thermal Management Applications

David C. Deisenroth, Martinus Adrian Arie, Serguei Dessiatoun, Amir Shooshtari, Michael Ohadi, Avram Bar-Cohen

Paper No: IPACK2015-48637

DOI: https://doi.org/10.1115/IPACK2015-48637

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Topics: Heat exchangers, Polymers, Thermal management, Additive manufacturing, Corrosion protection, Electrical conductivity, Heat transfer, Manufacturing, Stability, Temperature

Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi

J. Electron. Packag. December 2015, 137(4): 040803.

Paper No: EP-15-1063

DOI: https://doi.org/10.1115/1.4031602

Published Online: October 9, 2015

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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing

Proceedings Papers

Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube

Darin J. Sharar, Arthur E. Bergles, Nicholas R. Jankowski, Avram Bar-Cohen

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T03A016, August 3–7, 2014

Paper No: ICNMM2014-22029

DOI: https://doi.org/10.1115/ICNMM2014-22029

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Topics: Two-phase flow, Flow (Dynamics), Film thickness

Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar

J. Electron. Packag. March 2015, 137(1): 010801.

Paper No: EP-14-1069

DOI: https://doi.org/10.1115/1.4028890

Published Online: November 14, 2014

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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity

Journal Articles

Energy Efficient Two-Phase Microcooler Design for a Concentrated Photovoltaic Triple Junction Cell

Alexander Reeser, Peng Wang, Gad Hetsroni, Avram Bar-Cohen

J. Sol. Energy Eng. August 2014, 136(3): 031015.

Paper No: SOL-13-1011

DOI: https://doi.org/10.1115/1.4027422

Published Online: May 2, 2014

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Topics: Cooling, Flow (Dynamics), Microcoolers, Pressure drop, Temperature, Solar energy, Heat transfer coefficients, Junctions, Design, Solar cells

Proceedings Papers

Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes

Darin J. Sharar, Nicholas R. Jankowski, Avram Bar-Cohen

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A042, July 16–18, 2013

Paper No: IPACK2013-73199

DOI: https://doi.org/10.1115/IPACK2013-73199

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Topics: Flow (Dynamics), Heat transfer

Proceedings Papers

Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot

Michael Manno, Peng Wang, Avram Bar-Cohen

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A038, July 16–18, 2013

Paper No: IPACK2013-73186

DOI: https://doi.org/10.1115/IPACK2013-73186

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Topics: Cooling, Germanium, Thermoelectric cooling, Transients (Dynamics)

Journal Articles

Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm

Avram Bar-Cohen

J. Nanotechnol. Eng. Med. May 2013, 4(2): 020907.

Paper No: NANO-12-1130

DOI: https://doi.org/10.1115/1.4023898

Published Online: July 23, 2013

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Topics: Cooling, Thermal management, Microchannels

Proceedings Papers

Quantum-Well Si/SiC Self-Cooling for Thermal Management of High Heat Flux GaN HEMT Semiconductor Devices

Peng Wang, Michael Manno, Avram Bar-Cohen

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 615-624, March 3–6, 2012

Paper No: MNHMT2012-75290

DOI: https://doi.org/10.1115/MNHMT2012-75290

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Topics: Cooling, Gallium nitride, Heat flux, Quantum wells, Semiconductor devices, Thermal management, Wide band gap semiconductors, Electric current, Electron mobility, Integrated circuits

Journal Articles

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

Peng Wang, Patrick McCluskey, Avram Bar-Cohen

J. Electron. Packag. June 2013, 135(2): 021001.

Paper No: EP-12-1012

DOI: https://doi.org/10.1115/1.4023215

Published Online: March 28, 2013

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Topics: Cooling, Flow (Dynamics), Fluids, Heat transfer coefficients, Temperature, Vapors, Thermal resistance, Pressure drop, Thermal management

Proceedings Papers

Evaluation of Two-Phase Cold Plate for Cooling Electric Vehicle Power Electronics

Peng Wang, Patrick McCluskey, Avram Bar-Cohen

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 823-835, November 11–17, 2011

Paper No: IMECE2011-64330

DOI: https://doi.org/10.1115/IMECE2011-64330

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Topics: Cooling, Electric vehicles, Electronics, Temperature, Thermal management, Engines, Flow (Dynamics), Geometry, Heat flux, Motors

Proceedings Papers

The Impact of GaN/Substrate Thermal Boundary Resistance on a HEMT Device

Horacio C. Nochetto, Nicholas R. Jankowski, Avram Bar-Cohen

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 241-249, November 11–17, 2011

Paper No: IMECE2011-65562

DOI: https://doi.org/10.1115/IMECE2011-65562

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Topics: Gallium nitride, Interfacial thermal resistance, Temperature, Heat, Junctions, Design, Electron mobility, Engineering simulation, Finite element analysis, Simulation

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Journal citation

NARROW

Orientation Effects in Two-Phase Microgap Flow

Orientation Effects in Two-Phase Microgap Flow

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

Modeling Thermal Microspreading Resistance in Via Arrays

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization

Thermally-Optimum Design of GaN-on-SiC HEMT

Modeling Thermal Spreading Resistance in Via Arrays

Review of Most Recent Progress on Development of Polymer Heat Exchangers for Thermal Management Applications

Nanothermal Interface Materials: Technology Review and Recent Results

Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Energy Efficient Two-Phase Microcooler Design for a Concentrated Photovoltaic Triple Junction Cell

Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes

Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot

Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm

Quantum-Well Si/SiC Self-Cooling for Thermal Management of High Heat Flux GaN HEMT Semiconductor Devices

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

Evaluation of Two-Phase Cold Plate for Cooling Electric Vehicle Power Electronics

The Impact of GaN/Substrate Thermal Boundary Resistance on a HEMT Device

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