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Anthony J. Rafanelli
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Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
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Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

The Need for Versatility by Today’s Engineer in Dealing With Complex Engineering Systems

Anthony J. Rafanelli
Proc. ASME. IMECE96, Engineering Systems, 61, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0876
https://doi.org/10.1115/IMECE1996-0876
View Paper titled, The Need for Versatility by Today’s Engineer in Dealing With Complex Engineering Systems
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Topics: Engineering systems and industry applications, Engineers, Concurrent engineering, Quality management, Teams
Proceedings Papers

A Review of Changes and Trends Affecting Military Electronics Manufacturing

Anthony J. Rafanelli
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 447-451, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1122
https://doi.org/10.1115/IMECE1997-1122
View Paper titled, A Review of Changes and Trends Affecting Military Electronics Manufacturing
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes, US Department of Defense
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0820
https://doi.org/10.1115/IMECE1997-0820
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties
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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)
Proceedings Papers

A Methodology for Evaluating the Mechanical Reliability of Alternatives to Tin-Lead Solder Electronic Interconnection Systems (Focus on Electrically Conductive Adhesives)

Anthony J. Rafanelli
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 143-155, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24718
https://doi.org/10.1115/IMECE2001/EPP-24718
View Paper titled, A Methodology for Evaluating the Mechanical Reliability of Alternatives to Tin-Lead Solder Electronic Interconnection Systems (Focus on Electrically Conductive Adhesives)
Open the PDF for A Methodology for Evaluating the Mechanical Reliability of Alternatives to Tin-Lead Solder Electronic Interconnection Systems (Focus on Electrically Conductive Adhesives) in another window
Topics: Adhesives, Reliability, Solders, Creep, Fatigue, Fracture mechanics, Electronic components, Stress, Temperature, Thermal shock
Proceedings Papers

A Review of Electrically Conductive Adhesive Technology for Use in Surface-Mount Microelectronics

Anthony J. Rafanelli
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 197-202, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2263
https://doi.org/10.1115/IMECE2000-2263
View Paper titled, A Review of Electrically Conductive Adhesive Technology for Use in Surface-Mount Microelectronics
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Topics: Adhesives, Microelectronic devices, Surface mount packaging, Solders, Bonding, Electronics, Materials properties, Polymers, Surface mount technology
Proceedings Papers

The Lead-Free Interconnection Movement: A Pro-Active Approach to Understand the Effects on COTS Usage in the Aerospace and Defense Industries

Anthony J. Rafanelli
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 203-213, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39497
https://doi.org/10.1115/IMECE2002-39497
View Paper titled, The Lead-Free Interconnection Movement: A Pro-Active Approach to Understand the Effects on COTS Usage in the Aerospace and Defense Industries
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Topics: Aerospace industry, Defense industry, Performance characterization, Solders, Adhesives, Bearings, Electronics, Military systems, Reliability, Surface mount technology
Journal Articles

Lead-Free Implementation and Production–A Manufacturing Guide

Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2007, 129(1): 109–110.
https://doi.org/10.1115/1.2429719
Published Online: March 1, 2007
View Article titled, Lead-Free Implementation and Production–A Manufacturing Guide
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Topics: Manufacturing, Solders
Journal Articles

Electrical Properties of Polymers

Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2007, 129(1): 111.
https://doi.org/10.1115/1.2429720
Published Online: March 1, 2007
View Article titled, Electrical Properties of Polymers
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Topics: Electrical properties, Polymers
Journal Articles

Practical Guide to the Packaging of Electronics

ANTHONY J. RAFANELLI
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 539.
https://doi.org/10.1115/1.2070094
Published Online: December 1, 2005
View Article titled, Practical Guide to the Packaging of Electronics
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Topics: Electronic packaging, Design
Journal Articles

Environment-Friendly Electronics: Lead-Free Technology

ANTHONY J. RAFANELLI
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 537–538.
https://doi.org/10.1115/1.2070093
Published Online: December 1, 2005
View Article titled, Environment-Friendly Electronics: Lead-Free Technology
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Topics: Alloys, Electronics, Lead-free solders, Solders, Electronic packaging, Soldering, Tin, Low cycle fatigue
Journal Articles

Solders and Soldering

Howard H. Manko,, Author, Anthony J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
https://doi.org/10.1115/1.1503063
Published Online: July 26, 2002
View Article titled, Solders and Soldering
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Topics: Soldering, Solders, Alloys, Materials properties
Journal Articles

Coatings Technology Handbook, Second Edition

D. Satas,, Editor,, Arthur A. Tracton,, Editor, and, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2002, 124(1): 67–68.
https://doi.org/10.1115/1.1446069
Published Online: March 1, 2002
View Article titled, Coatings Technology Handbook, Second Edition
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Topics: Coatings, Testing
Journal Articles

Industrial Electonics: Devices and Systems, Second Edition

Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2001, 123(3): 319.
https://doi.org/10.1115/1.1387243
Published Online: September 1, 2001
View Article titled, Industrial Electonics: Devices and Systems, Second Edition
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Topics: Engineers, Transistors, Computers, Junctions, Electronics, Electronics engineers, Energy resources, Gates (Closures), Generators, Mechanical engineering
Journal Articles

Handbook of Electronic Package Design

Michael Pecht,, Editor, Anthony J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 2000, 122(2): 178–179.
https://doi.org/10.1115/1.483153
Published Online: June 1, 2000
View Article titled, Handbook of Electronic Package Design
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Topics: Design, Electronic packages, Thermal management, Printed circuit boards, Packaging
Journal Articles

Reliability of Photonics Materials and Structures (Proceedings of the Reliability of Photonics Materials and Structures Symposium held April 13–16, 1998 in San Francisco, CA)

Ephraim Suhir, Editor, Mitsuo Fukuda, Editor, Charles R. Kurkjian, Editor, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 1999, 121(1): 55.
https://doi.org/10.1115/1.2792662
Published Online: March 1, 1999
View Article titled, Reliability of Photonics Materials and Structures (Proceedings of the Reliability of Photonics Materials and Structures Symposium held April 13–16, 1998 in San Francisco, CA)
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Topics: Photonics, Reliability
Journal Articles

Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics is Wrong

Tony Kordyban, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 1998, 120(4): 395.
https://doi.org/10.1115/1.2792653
Published Online: December 1, 1998
View Article titled, Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics is Wrong
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Topics: Cooling, Electronics, Heat sinks
Journal Articles

Special Section on Manufacturing for the Electronics Industry

Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Preface
J. Electron. Packag. June 1998, 120(2): 117.
https://doi.org/10.1115/1.2792587
Published Online: June 1, 1998
View Article titled, Special Section on Manufacturing for the Electronics Industry
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Topics: Electronics, Manufacturing
Journal Articles

Printed Circuits Handbook, Fourth Edition

Clyde F. Coombs, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1998, 120(2): 213–214.
https://doi.org/10.1115/1.2792624
Published Online: June 1, 1998
View Article titled, Printed Circuits Handbook, Fourth Edition
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Topics: Circuits
Journal Articles

Modern Solder Technology for Competitive Electronics Manufacturing

Jennie S. Hwang, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1997, 119(3): 214–215.
https://doi.org/10.1115/1.2792238
Published Online: September 1, 1997
View Article titled, Modern Solder Technology for Competitive Electronics Manufacturing
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Topics: Electronics, Manufacturing, Solders