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Proceedings Papers

Methodology for the Inline Die Attach Characterization of Power LEDs

P. Szabo, G. Farkas, A. Poppe, M. Rencz
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 283-288, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32622
https://doi.org/10.1115/HT2007-32622
View Paper titled, Methodology for the Inline Die Attach Characterization of Power LEDs
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Topics: Light-emitting diodes, Testing, Production testing, Manufacturing, Operating temperature, Reliability, Silicon, Transients (Dynamics)
Proceedings Papers

Thermal Characterization and Modeling of Stacked Die Packages

P. Szabo, M. Rencz, V. Sze´kely, A. Poppe, G. Farkas, B. Courtois
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1575-1581, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73437
https://doi.org/10.1115/IPACK2005-73437
View Paper titled, Thermal Characterization and Modeling of Stacked Die Packages
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Topics: Modeling, Steady state, Thermal characterization, Transients (Dynamics)
Proceedings Papers

Testing the Die Attach Quality of 3D Stacked Dies

M. Rencz, V. Sze´kely, A. Poppe, B. Courtois, L. Zhang, N. Howard, L. Nguyen
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 249-256, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62418
https://doi.org/10.1115/IMECE2004-62418
View Paper titled, Testing the Die Attach Quality of 3D Stacked Dies
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Topics: Testing, Circuits
Journal Articles

Cross-Verification of Thermal Characterization of a Microcooler

Zs. Kohári, Gy. Bognár, Gy. Horváth, A. Poppe, M. Rencz, V. Székely
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 167–171.
https://doi.org/10.1115/1.2721089
Published Online: February 15, 2007
View Article titled, Cross-Verification of Thermal Characterization of a Microcooler
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Topics: Cooling, Flow (Dynamics), Heat flux, Microchannels, Microcoolers, Sensors, Thermal resistance, Transients (Dynamics), Heat, Transistors
Journal Articles

A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

Zs. Benedek, B. Courtois, G. Farkas, E. Kolla´r, S. Mir, A. Poppe, M. Rencz, V. Sze´kely, K. Torki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 323–330.
https://doi.org/10.1115/1.1389846
Published Online: June 2, 2001
View Article titled, A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation
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Topics: Design, Sensors, Temperature, Energy dissipation, Transients (Dynamics), Packaging, Resistors, Composite materials, Complementary metal oxide semiconductors