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Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
https://doi.org/10.1115/1.4043404
Published Online: July 30, 2019
View Article titled, Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management
Proceedings Papers

Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics

S. Khanna, P. McCluskey, M. Manno, A. Bar-Cohen, B. Yang, M. Ohadi
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A039, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-53749
https://doi.org/10.1115/IMECE2015-53749
View Paper titled, Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics
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Topics: Electronics, Packaging, Reliability, Thermal conductivity, Diamonds, Failure, Composite materials, Solder joints, Cooling, Copper
Journal Articles

In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation

R. M. Manglik, M. K. Jensen, A. Bar-Cohen, Z. H. Ayub
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: In Memoriam
J. Thermal Sci. Eng. Appl. September 2015, 7(3): 030101.
Paper No: TSEA-14-1150
https://doi.org/10.1115/1.4027949
Published Online: September 1, 2015
View Article titled, In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation
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Topics: Energy conservation, Engineering teachers, Heat transfer
Journal Articles

In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation

R. M. Manglik, M. K. Jensen, A. Bar-Cohen, Z. H. Ayub
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: In Memoriam
J. Heat Mass Transfer. December 2014, 136(12): 120101.
Paper No: HT-14-1415
https://doi.org/10.1115/1.4027883
Published Online: October 27, 2014
View Article titled, In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation
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Topics: Energy conservation, Engineering teachers, Heat transfer
Journal Articles

Thermal Management of Time-Varying High Heat Flux Electronic Devices

T. David, D. Mendler, A. Mosyak, A. Bar-Cohen, G. Hetsroni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021003.
Paper No: EP-13-1064
https://doi.org/10.1115/1.4027325
Published Online: April 29, 2014
View Article titled, Thermal Management of Time-Varying High Heat Flux Electronic Devices
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Topics: Flow (Dynamics), Heat flux, Heat sinks, Microchannels, Temperature, Fluids, Steady state, Vapors, Wall temperature, Boiling
Proceedings Papers

Energy Efficient Two-Phase Micro-Cooler Design for a Concentrated Photovoltaic Triple Junction Cell

A. Reeser, P. Wang, A. Bar-Cohen, G. Hetsroni
Proc. ASME. IMECE2012, Volume 6: Energy, Parts A and B, 1077-1092, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-85895
https://doi.org/10.1115/IMECE2012-85895
View Paper titled, Energy Efficient Two-Phase Micro-Cooler Design for a Concentrated Photovoltaic Triple Junction Cell
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Topics: Design, Junctions, Microcoolers, Cooling, Solar cells, Solar energy, Boiling, Coolers, Critical heat flux, Energy consumption
Journal Articles

Minimum Mass Polymer Seawater Heat Exchanger for LNG Applications

P. Luckow, A. Bar-Cohen, P. Rodgers
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2009, 1(3): 031009.
https://doi.org/10.1115/1.4001239
Published Online: April 23, 2010
View Article titled, Minimum Mass Polymer Seawater Heat Exchanger for LNG Applications
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Topics: Heat exchangers, Heat transfer, Polymers, Seawater, Thermal conductivity, Polymer composites, Manufacturing, Titanium, Fins, Methane
Journal Articles

Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

A. A. Watwe, A. Bar-Cohen, A. McNeil
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 95–105.
https://doi.org/10.1115/1.2792226
Published Online: June 1, 1997
View Article titled, Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package
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Topics: Pool boiling, Pressure, Subcooling, Critical heat flux, Boiling, Nucleate pool boiling
Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

S. M. You, T. W. Simon, A. Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 17–25.
https://doi.org/10.1115/1.2792195
Published Online: March 1, 1997
View Article titled, Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface
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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum
Journal Articles

Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid

S. M. You, T. W. Simon, A. Bar-Cohen, Y. S. Hong
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1995, 117(3): 687–692.
https://doi.org/10.1115/1.2822631
Published Online: August 1, 1995
View Article titled, Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid
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Topics: Boiling, Fluids, Pool boiling, Wetting, Computer cooling, Heat transfer, Cylinders, Electronic equipment, Heat flux, Heating
Journal Articles

Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components

D. E. Maddox, A. Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1994, 116(3): 237–240.
https://doi.org/10.1115/1.2905692
Published Online: September 1, 1994
View Article titled, Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components
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Topics: Design, Electronic components, Impingement cooling, Thermofluids
Journal Articles

Thermal and Hydrodynamic Phenomena in a Horizontal, Uniformly Heated Steam-Generating Pipe

A. Bar-Cohen, Z. Ruder, P. Griffith
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1987, 109(3): 739–745.
https://doi.org/10.1115/1.3248152
Published Online: August 1, 1987
View Article titled, Thermal and Hydrodynamic Phenomena in a Horizontal, Uniformly Heated Steam-Generating Pipe
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Topics: Pipes, Steam, Flow (Dynamics), Water, Boiler tubes, Flux (Metallurgy), Heat, Pressure, Temperature, Vapors
Journal Articles

Thermosyphon Boiling in Vertical Channels

A. Bar-Cohen, H. Schweitzer
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1985, 107(4): 772–778.
https://doi.org/10.1115/1.3247503
Published Online: November 1, 1985
View Article titled, Thermosyphon Boiling in Vertical Channels
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Topics: Boiling, Heat transfer, Heat flux, Ceramics, Cooling, Cooling systems, Flow (Dynamics), Integrated circuits, Plates (structures), Pool boiling
Journal Articles

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

A. Bar-Cohen, W. M. Rohsenow
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1984, 106(1): 116–123.
https://doi.org/10.1115/1.3246622
Published Online: February 1, 1984
View Article titled, Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates
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Topics: Natural convection, Plates (structures), Composite materials, Optimization, Boundary-value problems, Electronic packaging, Energy dissipation, Heat transfer, Heat transfer coefficients
Journal Articles

Optimum Cylindrical Pin Fin

A. Sonn, A. Bar-Cohen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 1981, 103(4): 814–815.
https://doi.org/10.1115/1.3244547
Published Online: November 1, 1981
View Article titled, Optimum Cylindrical Pin Fin
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Journal Articles

International Trends in Engineering Design Education—A Partial View

A. Bar-Cohen
Journal: Journal of Mechanical Design
Publisher: ASME
Article Type: Research Papers
J. Mech. Des. October 1979, 101(4): 540–545.
https://doi.org/10.1115/1.3454098
Published Online: October 1, 1979
View Article titled, International Trends in Engineering Design Education—A Partial View
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Topics: Education, Engineering design, Design, Engineering students, Innovation, Students, Undergraduate students
Journal Articles

Fin Thickness for an Optimized Natural Convection Array of Rectangular Fins

A. Bar-Cohen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. August 1979, 101(3): 564–566.
https://doi.org/10.1115/1.3451032
Published Online: August 1, 1979
View Article titled, Fin Thickness for an Optimized Natural Convection Array of Rectangular Fins
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Topics: Fins, Natural convection
Journal Articles

Editorial/Conference Focus

C. W. McLarnan, A. Bar-Cohen
Journal: Journal of Mechanical Design
Publisher: ASME
Article Type: Editorial
J. Mech. Des. October 1978, 100(4): 585–586.
https://doi.org/10.1115/1.3453972
Published Online: October 1, 1978
View Article titled, Editorial/Conference Focus
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