Lamination is one of common defects in the manufacturing process of seamless metallic pipes. In this paper, the interaction between the circumferential Lamb waves and lamination in the midplane of an aluminum pipe is studied. The used circumferential Lamb waves are CL0 and CL1 modes generated with a finite element method code. Lamination along the circumferential direction is established by the demerging-node method. Numerical results of arrival time are compared with theoretical results in order to verify the accuracy of the excitation ways. The interaction between circumferential Lamb waves and lamination in a damaged full circular pipe is analyzed by composing the received waveforms of the corresponding receivers when CL0 and CL1 modes are excited at different excitation positions: the inner subpipe, the outer subpipe, and the main pipe. The composed waveforms fit well with the original waveforms. When CL0/CL1 mode reaches the entrance and exit of a lamination, it generates new mode and undergoes multiple reverberations, diffraction, and mode conversion between the two ends of the lamination. Based on the detailed analysis of the waveform in detail, some phenomena, which are different from those in a plate, are observed.
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February 2018
Research-Article
Interaction Between Circumferential Lamb Waves and Lamination in the Midplane of a Metallic Pipe Available to Purchase
Ziming Li,
Ziming Li
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: b201301lzm@emails.bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: b201301lzm@emails.bjut.edu.cn
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Cunfu He,
Cunfu He
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: hecunfu@bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: hecunfu@bjut.edu.cn
Search for other works by this author on:
Zenghua Liu,
Zenghua Liu
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: liuzenghua@bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: liuzenghua@bjut.edu.cn
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Yan Lu,
Yan Lu
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: lvyan@bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: lvyan@bjut.edu.cn
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Bin Wu
Bin Wu
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: wb@bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: wb@bjut.edu.cn
Search for other works by this author on:
Ziming Li
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: b201301lzm@emails.bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: b201301lzm@emails.bjut.edu.cn
Cunfu He
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: hecunfu@bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: hecunfu@bjut.edu.cn
Zenghua Liu
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: liuzenghua@bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: liuzenghua@bjut.edu.cn
Yan Lu
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: lvyan@bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: lvyan@bjut.edu.cn
Bin Wu
College of Mechanical Engineering and
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: wb@bjut.edu.cn
Applied Electronics Technology,
Beijing University of Technology,
Beijing 100124, China
e-mail: wb@bjut.edu.cn
1Corresponding author.
Contributed by the Pressure Vessel and Piping Division of ASME for publication in the JOURNAL OF PRESSURE VESSEL TECHNOLOGY. Manuscript received February 22, 2017; final manuscript received October 17, 2017; published online December 7, 2017. Assoc. Editor: Hardayal S. Mehta.
J. Pressure Vessel Technol. Feb 2018, 140(1): 011406 (15 pages)
Published Online: December 7, 2017
Article history
Received:
February 22, 2017
Revised:
October 17, 2017
Citation
Li, Z., He, C., Liu, Z., Lu, Y., and Wu, B. (December 7, 2017). "Interaction Between Circumferential Lamb Waves and Lamination in the Midplane of a Metallic Pipe." ASME. J. Pressure Vessel Technol. February 2018; 140(1): 011406. https://doi.org/10.1115/1.4038309
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