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Keywords: 3D spatial packaging of interconnected systems with physical interactions
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Journal Articles
Journal:
Journal of Mechanical Design
Publisher: ASME
Article Type: Research Papers
J. Mech. Des. July 2025, 147(7): 071704.
Paper No: MD-24-1444
Published Online: January 30, 2025
... optimizing 3D spatial packaging of interconnected systems with physics interactions (SPI2) requires a comprehensive understanding of various system requirements, including manufacturing, assembly, testing, operation, and maintenance [ 1 – 3 ]. Defense Advanced Research Projects Agency 10.13039...
