1-8 of 8
Keywords: tin alloys
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2007, 129(1): 19–28.
Published Online: December 6, 2005
... piezoelectric actuators piezoceramics plates (structures) eutectic alloys tin alloys lead alloys elasticity plasticity fatigue cracks reliability Solder joints play a very important role in surface mounted microelectronic packages, providing electrical and mechanical connections between...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. April 2006, 128(2): 142–150.
Published Online: May 11, 2005
.... Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter. 21 04 2003 11 05 2005 tin alloys silver alloys creep fatigue solders ductility slip Solder connections in electronic devices are exposed to low...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2005, 127(1): 46–57.
Published Online: February 22, 2005
... received January 1, 2003; revision received September 14, 2004. Review conducted by: H. Sehitoglu. 01 January 2003 14 September 2004 22 02 2005 titanium alloys aluminium alloys tin alloys zirconium alloys molybdenum alloys silicon alloys surface cracks dislocation pile-ups...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. April 2003, 125(2): 215–221.
Published Online: April 4, 2003
... and theoretical treatments of different absorbing devices. tin alloys lead alloys finite element analysis superplasticity 04 December 2001 03 July 2002 04 04 2003 Contributed by the Materials Division for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2003, 125(1): 81–88.
Published Online: December 31, 2002
... received July 8, 2002. Associate Editor: E. Werner. 22 November 2001 08 July 2002 31 12 2002 tin alloys lead alloys diffusion creep slip dislocation climb eutectic alloys soldering 63Sn/37Pb eutectic solder is commonly used in electronic packaging for both mechanical...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2001, 123(1): 74–84.
Published Online: November 23, 1999
...A. A. Tseng, Fellow ASME; M. H. Lee; B. Zhao A droplet generator has been designed and built to make wax and tin alloy droplets for freeform fabrication. The linear stability theory of liquid jets for forming droplets is first reviewed. The analytical formula for predicting droplet size and breakup...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2000, 122(1): 93–97.
Published Online: May 14, 1999
... of rate-dependent materials (e.g., superplastic materials). superplasticity lead alloys tin alloys yield strength tensile testing 15 November 1998 14 May 1999 Contributed by the Materials Division for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY...