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Keywords: bonding processes
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2007, 129(1): 19–28.
Published Online: December 6, 2005
... also present in the solder layer of specimens tested at high applied voltages, but the voids did not hinder the initiation and growth of cracks from the ends of the specimens. 10 12 2004 06 12 2005 soldering bonding processes couplings shear deformation plastic deformation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 2005, 127(3): 337–350.
Published Online: March 22, 2005
... responses for the random glass–vinyl ester specimens Applied stress vs crack density for the random glass–vinyl ester specimens fibre reinforced composites bonding processes elasticity microcracks continuum mechanics finite element analysis acoustic emission Short-fiber...