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Journal Articles

A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond

Song Yuan, Xiaoguang Guo, Hao Wang, Shang Gao
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2023, 145(7): 071006.
Paper No: MANU-22-1408
DOI: https://doi.org/10.1115/1.4057008
Published Online: March 21, 2023
View Article titled, A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond
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Topics: Damage, Diamonds, Machining, Polishing, Simulation, Ultraviolet radiation
Journal Articles

Identification of Tool Life Stages and Redressing Criterion for Polycrystalline Diamond Micro-Grinding Tools Using a Machine Learning Approach

Ashwani Pratap, Karali Patra, Suhas S. Joshi
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2023, 145(4): 041007.
Paper No: MANU-22-1428
DOI: https://doi.org/10.1115/1.4056490
Published Online: January 19, 2023
View Article titled, Identification of Tool Life Stages and Redressing Criterion for Polycrystalline Diamond Micro-Grinding Tools Using a Machine Learning Approach
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Topics: Cutting, Grinding, Machine learning, Support vector machines, Wear, Diamonds, Machining, Algorithms
Journal Articles

Turning Parameters Optimization for Diffraction Effect Suppression of Diamond-Turned Surface Combining Surface Micro-Topography Model and Scattering Theory

Pengfeng Sheng, Zhengxiang Shen, Li Jiang, Shenghuan Fang, Zhanshan Wang
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. November 2021, 143(11): 111011.
Paper No: MANU-20-1721
DOI: https://doi.org/10.1115/1.4051058
Published Online: June 14, 2021
View Article titled, Turning Parameters Optimization for Diffraction Effect Suppression of Diamond-Turned Surface Combining Surface Micro-Topography Model and Scattering Theory
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Topics: Diamonds, Diffraction, Scattering theory
Journal Articles

Ultra-Precision Machining: Cutting With Diamond Tools

D. A. Lucca, M. J. Klopfstein, O. Riemer
Journal: Journal of Manufacturing Science and Engineering
Article Type: Review Articles
J. Manuf. Sci. Eng. November 2020, 142(11): 110817.
Paper No: MANU-20-1087
DOI: https://doi.org/10.1115/1.4048194
Published Online: October 5, 2020
View Article titled, Ultra-Precision Machining: Cutting With Diamond Tools
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Topics: Cutting, Diamond tools, Diamond turning, Diamonds, Machining, Crystals, Milling, Machine tools
Journal Articles

Investigation of Tool and Workpiece Interaction on Surface Quality While Diamond Turning of Copper Beryllium Alloy

A. Sharma, Suhas S. Joshi, D. Datta, R. Balasubramaniam
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. February 2020, 142(2): 021011.
Paper No: MANU-19-1316
DOI: https://doi.org/10.1115/1.4045721
Published Online: January 3, 2020
View Article titled, Investigation of Tool and Workpiece Interaction on Surface Quality While Diamond Turning of Copper Beryllium Alloy
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Topics: Cutting, Diamond turning, Machining, Surface roughness, Contamination, Particulate matter, Diamonds, Wear
Journal Articles

Molecular Dynamics Simulation of Mechanical Polishing on Stainless Steel Using Diamond Nanoparticles

Prabhat Ranjan, R. Balasubramaniam, V.K. Jain
Journal: Journal of Manufacturing Science and Engineering
Article Type: Technical Briefs
J. Manuf. Sci. Eng. January 2019, 141(1): 014504.
Paper No: MANU-18-1016
DOI: https://doi.org/10.1115/1.4041914
Published Online: November 26, 2018
View Article titled, Molecular Dynamics Simulation of Mechanical Polishing on Stainless Steel Using Diamond Nanoparticles
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Topics: Diamonds, Molecular dynamics simulation, Particulate matter, Polishing, Simulation
Journal Articles

High-Speed Drawing of Al Alloy Wire by Diamond-Coated Drawing Die Under Environmentally Friendly Water-Based Emulsion Lubrication

Xinchang Wang, Chengchuan Wang, Xiaotian Shen, Fanghong Sun
Journal: Journal of Manufacturing Science and Engineering
Article Type: Technical Briefs
J. Manuf. Sci. Eng. December 2018, 140(12): 124502.
Paper No: MANU-17-1680
DOI: https://doi.org/10.1115/1.4041477
Published Online: October 5, 2018
View Article titled, High-Speed Drawing of Al Alloy Wire by Diamond-Coated Drawing Die Under Environmentally Friendly Water-Based Emulsion Lubrication
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Topics: Aluminum alloys, Diamonds, Emulsions, Lubrication, Tribology, Water, Wire, Diamond films, Polishing, Wear
Journal Articles

Wear Mechanism and Modeling of Tribological Behavior of Polycrystalline Diamond Tools When Cutting Ti6Al4V

Guangxian Li, Shuang Yi, Cuie Wen, Songlin Ding
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2018, 140(12): 121011.
Paper No: MANU-18-1227
DOI: https://doi.org/10.1115/1.4041327
Published Online: October 5, 2018
View Article titled, Wear Mechanism and Modeling of Tribological Behavior of Polycrystalline Diamond Tools When Cutting Ti6Al4V
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Topics: Cutting, Stress, Temperature, Tribology, Wear, Diamonds, Shear stress, Adhesion, Abrasion, Flow (Dynamics)
Journal Articles

Drilling CFRP Laminates by Dual-Axis Grinding Wheel System With Copper/Diamond Functionally Graded Grinding Wheel

Takahiro Kunimine, Hideaki Tsuge, Daisuke Ogawa, Motoko Yamada, Hisashi Sato, Yoshimi Watanabe
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. July 2018, 140(7): 071011.
Paper No: MANU-17-1202
DOI: https://doi.org/10.1115/1.4039650
Published Online: May 11, 2018
View Article titled, Drilling CFRP Laminates by Dual-Axis Grinding Wheel System With Copper/Diamond Functionally Graded Grinding Wheel
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Topics: Carbon reinforced plastics, Drilling, Grinding wheels, Laminates, Diamonds, Machining, Copper, Thrust, Hole quality
Journal Articles

Feasibility Study of Longitudinal–Torsional-Coupled Rotary Ultrasonic Machining of Brittle Material

Jianjian Wang, Jianfu Zhang, Pingfa Feng, Ping Guo, Qiaoli Zhang
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. May 2018, 140(5): 051008.
Paper No: MANU-17-1408
DOI: https://doi.org/10.1115/1.4038728
Published Online: March 6, 2018
View Article titled, Feasibility Study of Longitudinal–Torsional-Coupled Rotary Ultrasonic Machining of Brittle Material
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Topics: Brittleness, Cutting, Diamonds, Machining, Surface roughness, Ultrasonic machining, Vibration, Fracture (Materials), Trajectories (Physics), Abrasives
Journal Articles

An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw

Hui Huang, Xixi Li, Xipeng Xu
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2017, 139(12): 121011.
Paper No: MANU-17-1201
DOI: https://doi.org/10.1115/1.4038109
Published Online: November 2, 2017
View Article titled, An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw
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Topics: Diamonds, Sapphire, Sawing, Wire
Journal Articles

Grinding of Chromium Carbide Coatings Using Electroplated Diamond Wheels

Zhongde Shi, Amr Elfizy, Helmi Attia, Gilbert Ouellet
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2017, 139(12): 121014.
Paper No: MANU-17-1207
DOI: https://doi.org/10.1115/1.4037183
Published Online: November 2, 2017
View Article titled, Grinding of Chromium Carbide Coatings Using Electroplated Diamond Wheels
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Topics: Grinding, Wheels, Coatings, Diamonds, Surface roughness
Journal Articles

Performance of Diamond and Silicon Carbide Wheels on Grinding of Bioceramic Material Under Minimum Quantity Lubrication Condition

P. Suya Prem Anand, N. Arunachalam, L. Vijayaraghavan
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2017, 139(12): 121019.
Paper No: MANU-17-1235
DOI: https://doi.org/10.1115/1.4037940
Published Online: November 2, 2017
View Article titled, Performance of Diamond and Silicon Carbide Wheels on Grinding of Bioceramic Material Under Minimum Quantity Lubrication Condition
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Topics: Diamonds, Grinding, Grinding wheels, Wheels, Silicon, Fluids, Lubrication
Journal Articles

Diamond Wheel Dressing: A Comprehensive Review

Wenfeng Ding, Haonan Li, Liangchi Zhang, Jiuhua Xu, Yucan Fu, Honghua Su
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2017, 139(12): 121006.
Paper No: MANU-17-1177
DOI: https://doi.org/10.1115/1.4037991
Published Online: November 2, 2017
View Article titled, Diamond Wheel Dressing: A Comprehensive Review
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Topics: Diamonds, Grinding wheels, Lasers, Wheels, Grinding
Journal Articles

A Molecular Dynamics Simulation Study of Material Removal Mechanisms in Vibration Assisted Nano Impact-Machining by Loose Abrasives

Sagil James, Murali Sundaram
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. August 2017, 139(8): 081014.
Paper No: MANU-16-1452
DOI: https://doi.org/10.1115/1.4036559
Published Online: May 11, 2017
View Article titled, A Molecular Dynamics Simulation Study of Material Removal Mechanisms in Vibration Assisted Nano Impact-Machining by Loose Abrasives
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Topics: Abrasives, Borosilicate glasses, Heat resistant glass, Kinetic energy, Machining, Nanoparticles, Nanoscale phenomena, Silicon, Simulation, Vibration
Journal Articles

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Ping Zhou, Ying Yan, Ning Huang, Ziguang Wang, Renke Kang, Dongming Guo
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. August 2017, 139(8): 081012.
Paper No: MANU-16-1608
DOI: https://doi.org/10.1115/1.4036125
Published Online: May 10, 2017
View Article titled, Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding
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Topics: Deformation, Diamonds, Grinding, Semiconductor wafers, Stress, Wheels, Stress concentration, Damage, Silicon
Journal Articles

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

Shujuan Li, Aofei Tang, Yong Liu, Jiabin Wang, Dan Cui, Robert G. Landers
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. April 2017, 139(4): 041003.
Paper No: MANU-16-1250
DOI: https://doi.org/10.1115/1.4034792
Published Online: October 18, 2016
View Article titled, Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing
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Topics: Cutting, Semiconductor wafers, Wire, Machining, Modeling, Diamonds
Journal Articles

An Assessment of the Wear Characteristics of Microcutting Arrays Produced From Polycrystalline Diamond and Cubic Boron Nitride Composites

M. Pacella, D. A. Axinte, P. W. Butler-Smith, P. Shipway, M. Daine, C. Wort
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. February 2016, 138(2): 021001.
Paper No: MANU-14-1583
DOI: https://doi.org/10.1115/1.4030761
Published Online: September 9, 2015
View Article titled, An Assessment of the Wear Characteristics of Microcutting Arrays Produced From Polycrystalline Diamond and Cubic Boron Nitride Composites
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Topics: Composite materials, Cutting, Diamonds, Wear, Binders (Materials)
Journal Articles

A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond

Florestan Schindler, Richard Brocker, Fritz Klocke, Patrick Mattfeld
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. January 2016, 138(1): 011002.
Paper No: MANU-14-1449
DOI: https://doi.org/10.1115/1.4029804
Published Online: September 9, 2015
View Article titled, A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond
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Topics: Diamonds, Grinding
Journal Articles

Force Modeling and Control of SiC Monocrystal Wafer Processing

Shujuan Li, Siming Du, Aofei Tang, Robert G. Landers, Yang Zhang
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2015, 137(6): 061003.
Paper No: MANU-14-1309
DOI: https://doi.org/10.1115/1.4029432
Published Online: September 9, 2015
View Article titled, Force Modeling and Control of SiC Monocrystal Wafer Processing
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Topics: Cutting, Semiconductor wafers, Wire, Machining, Control equipment, Surface roughness, Diamonds, Tension