Injection molding process is a widely used manufacturing technique to massively produce the components of mobile device with various sizes and complicated geometries. However, the final part quality, especially dimension or geometry, referring to the original design specifications is not often acceptable due to various reasons. This study aims at developing the numerical model to predict the final part quality and subsequently identifying the critical reasons for existing problems. moldflow and abaqus software have been simultaneously used to simulate the injection molding process and thermal deformation arising after ejection step from the mold. In order to validate the model, the deformation predicted by the developed model was compared with experimental results, and both results showed good agreement. We also carried out design of experiment (DOE) to investigate the effect of various processing parameters that affect the final deformation of injection molded product. The developed model and information derived from DOE are expected to provide useful resources to the initial stage of mobile device design.
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February 2013
Research-Article
Identification of Controlling Parameters on Thermal Deformation of Mobile Device by Injection Molding Process
Eunyoung Chang,
Eunyoung Chang
Department of Mechanical Engineering
,Hongik University
, Seoul, 121-791
, Korea
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Haseung Chung
Haseung Chung
1
e-mail: haseung@hongik.ac.kr
Department of Mechanical and System
Design Engineering
,Hongik University
,Seoul, 121-791
, Korea
1Corresponding author.
Search for other works by this author on:
Eunyoung Chang
Department of Mechanical Engineering
,Hongik University
, Seoul, 121-791
, Korea
Haseung Chung
e-mail: haseung@hongik.ac.kr
Department of Mechanical and System
Design Engineering
,Hongik University
,Seoul, 121-791
, Korea
1Corresponding author.
Contributed by the Manufacturing Engineering Division of ASME for publication in the Journal of Manufacturing Science and Engineering. Manuscript received March 12, 2012; final manuscript received November 12, 2012; published online January 22, 2013. Assoc. Editor: Allen Y. Yi.
J. Manuf. Sci. Eng. Feb 2013, 135(1): 011008 (9 pages)
Published Online: January 22, 2013
Article history
Received:
March 12, 2012
Revision Received:
November 12, 2012
Citation
Chang, E., Shin, S., and Chung, H. (January 22, 2013). "Identification of Controlling Parameters on Thermal Deformation of Mobile Device by Injection Molding Process." ASME. J. Manuf. Sci. Eng. February 2013; 135(1): 011008. https://doi.org/10.1115/1.4023284
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