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Keywords: electronic packages
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2015, 137(8): 081401.
Paper No: HT-13-1570
Published Online: August 1, 2015
... decrease the performance of multilayered electronic packages during a thermal transient duty cycle. In fact, when the coolant temperature varies with the optimum angular frequency, i.e., ω ≈ 0 . 3 , the amplitude of heat dissipation from a multilayered package increases compared...