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1-14 of 14
Keywords: MEMS
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2022, 144(7): 071801.
Paper No: HT-21-1657
Published Online: April 27, 2022
... and heat transfer in micro-electromechanical system (MEMS) devices. e-mail: dai_lf@sjtu.edu.cn 1 Corresponding author. e-mail: whysrj@sjtu.edu.cn 03 10 2021 22 03 2022 27 04 2022 gas flow around square cylinder transition flow regime rarefaction effect heat transfer...
Topics:
Cylinders,
Drag (Fluid dynamics),
Flow (Dynamics),
Gas flow,
Heat transfer,
Inflow,
Temperature,
Knudsen number,
Mach number
Includes: Supplementary data
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2015, 137(4): 041701.
Paper No: HT-13-1506
Published Online: April 1, 2015
... to conjugate heat transfer effect, is observed even for a small value of solid conductivity, the performances in terms of heat sink efficiency are essentially a function only of the Mach number. MEMS rarefied gas dynamics conjugate heat transfer compressibility Obvious manufacturing...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2013, 135(10): 101005.
Paper No: HT-12-1329
Published Online: September 11, 2013
... Knudsen and Mach numbers. roughness MEMS rarefied gas dynamics hybrid method kinetic equation In MEMS fabrication due to the small scale, it is nearly impossible to create an actual smooth surface. On the other hand, surface roughness may have a significant impact on microchannel...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 2010, 132(11): 111801.
Published Online: August 10, 2010
... axial conduction cryogenic MEMS Schematic of a single plate The model is developed in dimensionless form in order to maximize its utility and modularity. The dimensionless temperatures of the hot fluid ( θ h ) , cold fluid ( θ c ) , and wall ( θ...
Journal Articles
Leslie M. Phinney, Justin R. Serrano, Edward S. Piekos, John R. Torczynski, Michael A. Gallis, Allen D. Gorby
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2010, 132(7): 072402.
Published Online: April 28, 2010
...Leslie M. Phinney; Justin R. Serrano; Edward S. Piekos; John R. Torczynski; Michael A. Gallis; Allen D. Gorby This paper reports on experimental and computational investigations into the thermal performance of microelectromechanical systems (MEMS) as a function of the pressure of the surrounding...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2009, 131(12): 121011.
Published Online: October 15, 2009
... individual sensor. Experiment setup The setup, as shown in Fig. 2 , consists of three primary subsystems: the flow loop section, instrumentation, and a data acquisition system. The test section houses the MEMS microchannel devices and its fluidic and thermal packaging module. The microchannel...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2009, 131(5): 052401.
Published Online: March 16, 2009
.... The cold-side temperature began at room temperature and reached a steady state temperature of approximately 50 ° C before the apparent thermal conductivity was determined. To further assess the ability of the proposed micro-insulation to provide adequate performance in a MEMS...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2008, 130(12): 122401.
Published Online: September 16, 2008
... measurements on electrically powered MEMS actuators powered with a periodic signal. Furthermore, we demonstrate a way of obtaining reliable temperature measurements on micron-scale devices that undergo mechanical movement during the device operation. 13 08 2007 10 06 2008 16 09 2008...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. August 2008, 130(8): 084501.
Published Online: May 29, 2008
... micromechanical devices nucleate boiling bubble behavior MEMS artificial cavity Since boiling heat transfer has a high heat transfer coefficient, it has been used as a cooling technique for high-temperature bodies. The boiling phenomena have been investigated for more than 60 – 70 years...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2008, 130(4): 042403.
Published Online: March 17, 2008
... derived (Appendix) and solved a predictive mathematical model for the rates of water vapor mass transfer m ̇ av from the apparatus of Fig. 1 , 5 m ̇ av = ∫ r o r = 0 2 π r R BL , downstream + R mem { ∫ r o r = 0 1 δ ( r...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. July 2007, 129(7): 813–818.
Published Online: October 2, 2006
... to practically utilize thermally expandable flexible thin films, especially in MEMS and electronic cooling applications. 15 03 2006 02 10 2006 microchannel flow film flow heat transfer temperature distribution thermal expansion elastic constants numerical analysis thin films heat...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. July 2007, 129(7): 844–851.
Published Online: July 10, 2006
... 10 07 2006 microchannel flow heat sinks mass transfer flow visualisation forced convection two-phase flow boiling critical heat flux boiling microchannels flow pattern MEMS Forced convection boiling in microchannels is recognized as an enabling heat transfer mode...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. March 2007, 129(3): 329–334.
Published Online: May 31, 2006
... silicon elemental semiconductors micromechanical devices coherent antiStokes Raman scattering spectral line breadth thermal stresses calibration spectral methods of temperature measurement stress effects Raman spectroscopy MEMS thermometry thermal stresses Recent developments...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 2006, 128(2): 121–131.
Published Online: August 8, 2005
... laminar flow thermal resistance friction pipe flow boundary layers flow separation MEMS heat sink pin fin cross flow friction factor microchannel In pursuit of cooling solutions for the ever-increasing demand for
integrated circuit (IC) power density, micro scale...