A device for measuring a plurality of material properties is designed to include accurate sensors configured to consecutively obtain thermal conductivity, electrical conductivity, and Seebeck coefficient of a single sample while maintaining a vacuum or inert gas environment. Four major design factors are identified as sample-heat spreader mismatch, radiation losses, parasitic losses, and sample surface temperature variance. The design is analyzed using finite element methods for high temperature ranges up to 1000 °C as well as ultra-high temperatures up to 2500 °C. A temperature uncertainty of 0.46% was estimated for a sample with cold and hot sides at 905.1 and 908.5 °C, respectively. The uncertainty at 1000 °C was calculated to be 0.7% for a ΔT of 5 °C between the hot and cold sides. The thermal conductivity uncertainty was calculated to be −8.6% at ∼900 °C for a case with radiative gains, and +8.2% at ∼1000 °C for a case with radiative losses, indicating the sensitivity of the measurement to the temperature of the thermal guard in relation to the heat spreader and sample temperature. Lower limits of −17 and −13% error in thermal conductivity measurements were estimated at the ultra-high temperature of ∼2500 °C for a single-stage and double-stage radiation shield, respectively. It is noted that this design is not limited to electro-thermal characterization and will enable measurement of ionic conductivity and surface temperatures of energy materials under realistic operating conditions in extreme temperature environments.
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A High Temperature Instrument for Consecutive Measurements of Thermal Conductivity, Electrical Conductivity, and Seebeck Coefficient
Sajad Yazdani,
Sajad Yazdani
Department of Mechanical Engineering,
University of Connecticut,
Storrs, CT 06269
University of Connecticut,
Storrs, CT 06269
1Sajad Yazdani and Hyun-Young Kim both contributed equally.
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Hyun-Young Kim,
Hyun-Young Kim
Department of Mechanical Engineering,
University of Connecticut,
Storrs, CT 06269
University of Connecticut,
Storrs, CT 06269
1Sajad Yazdani and Hyun-Young Kim both contributed equally.
Search for other works by this author on:
Michael Thompson Pettes
Michael Thompson Pettes
Department of Mechanical Engineering,
University of Connecticut,
Storrs, CT 06269;
Materials Physics and Applications Division,
Center for Integrated Nanotechnologies (CINT),
Los Alamos National Laboratory,
Los Alamos, NM 87545
e-mail: pettesmt@lanl.gov
University of Connecticut,
Storrs, CT 06269;
Materials Physics and Applications Division,
Center for Integrated Nanotechnologies (CINT),
Los Alamos National Laboratory,
Los Alamos, NM 87545
e-mail: pettesmt@lanl.gov
2Corresponding author.
Search for other works by this author on:
Sajad Yazdani
Department of Mechanical Engineering,
University of Connecticut,
Storrs, CT 06269
University of Connecticut,
Storrs, CT 06269
Hyun-Young Kim
Department of Mechanical Engineering,
University of Connecticut,
Storrs, CT 06269
University of Connecticut,
Storrs, CT 06269
Michael Thompson Pettes
Department of Mechanical Engineering,
University of Connecticut,
Storrs, CT 06269;
Materials Physics and Applications Division,
Center for Integrated Nanotechnologies (CINT),
Los Alamos National Laboratory,
Los Alamos, NM 87545
e-mail: pettesmt@lanl.gov
University of Connecticut,
Storrs, CT 06269;
Materials Physics and Applications Division,
Center for Integrated Nanotechnologies (CINT),
Los Alamos National Laboratory,
Los Alamos, NM 87545
e-mail: pettesmt@lanl.gov
1Sajad Yazdani and Hyun-Young Kim both contributed equally.
2Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received August 10, 2018; final manuscript received April 9, 2019; published online May 17, 2019. Assoc. Editor: Ali Khounsary.
J. Heat Transfer. Jul 2019, 141(7): 071602 (12 pages)
Published Online: May 17, 2019
Article history
Received:
August 10, 2018
Revised:
April 9, 2019
Citation
Yazdani, S., Kim, H., and Pettes, M. T. (May 17, 2019). "A High Temperature Instrument for Consecutive Measurements of Thermal Conductivity, Electrical Conductivity, and Seebeck Coefficient." ASME. J. Heat Transfer. July 2019; 141(7): 071602. https://doi.org/10.1115/1.4043572
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