Experimental studies are presented to show the effect of thermal stresses on thermal contact conductance (TCC) at low contact pressures. It is observed that in a closed contact assembly, contact pressure acting on the interface changes with the changing temperature of contact members. This change in contact pressure consequently causes variations in the TCC of the junction. A relationship between temperature change and the corresponding magnitude of developed thermal stress in a contact assembly is determined experimentally. Inclusion of a term called temperature dependent load correction factor is suggested in the theoretical model for TCC to make it capable of predicting TCC values more accurately in contact assemblies that experience large temperature fluctuations.
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September 2010
This article was originally published in
Journal of Heat Transfer
Technical Briefs
An Experimental Study to Show the Effect of Thermal Stress on Thermal Contact Conductance at Sub-megapascal Contact Pressures
Prashant Misra,
Prashant Misra
Department of Instrumentation,
Indian Institute of Science
, Bangalore 560012, India
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J. Nagaraju
J. Nagaraju
Department of Instrumentation,
e-mail: solarjnr@isu.iisc.ernet.in
Indian Institute of Science
, Bangalore 560012, India
Search for other works by this author on:
Prashant Misra
Department of Instrumentation,
Indian Institute of Science
, Bangalore 560012, India
J. Nagaraju
Department of Instrumentation,
Indian Institute of Science
, Bangalore 560012, Indiae-mail: solarjnr@isu.iisc.ernet.in
J. Heat Transfer. Sep 2010, 132(9): 094501 (4 pages)
Published Online: June 29, 2010
Article history
Received:
July 3, 2009
Revised:
March 1, 2010
Online:
June 29, 2010
Published:
June 29, 2010
Citation
Misra, P., and Nagaraju, J. (June 29, 2010). "An Experimental Study to Show the Effect of Thermal Stress on Thermal Contact Conductance at Sub-megapascal Contact Pressures." ASME. J. Heat Transfer. September 2010; 132(9): 094501. https://doi.org/10.1115/1.4001615
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