We report an experimental investigation of a novel, high performance ultrathin manifold microchannel heat sink. The heat sink consists of impinging liquid slot-jets on a structured surface fed with liquid coolant by an overlying two-dimensional manifold. We developed a fabrication and packaging procedure to manufacture prototypes by means of standard microprocessing. A closed fluid loop for precise hydrodynamic and thermal characterization of six different test vehicles was built. We studied the influence of the number of manifold systems, the width of the heat transfer microchannels, the volumetric flow rate, and the pumping power on the hydrodynamic and thermal performance of the heat sink. A design with 12.5 manifold systems and wide microchannels as the heat transfer structure provided the optimum choice of design parameters. For a volumetric flow rate of 1.3 l/min we demonstrated a total thermal resistance between the maximum heater temperature and fluid inlet temperature of with a pressure drop of 0.22 bar on a chip. This allows for cooling power densities of more than for a maximum temperature difference between the chip and the fluid inlet of 65 K. The total height of the heat sink did not exceed 2 mm, and includes a thick thermal test chip structured by deep microchannels for heat transfer. Furthermore, we discuss the influence of elevated fluid inlet temperatures, allowing possible reuse of the thermal energy, and demonstrate an enhancement of the heat sink cooling efficiency of more than 40% for a temperature rise of 50 K.
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Research Papers
Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
W. Escher,
W. Escher
Zurich Research Laboratory,
IBM Research GmbH
, Rüschlikon 8803, Switzerland; Department of Mechanical and Process Engineering, Laboratory of Thermodynamics in Emerging Technologies, ETH Zurich
, Zurich 8092, Switzerland
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T. Brunschwiler,
T. Brunschwiler
Zurich Research Laboratory,
IBM Research GmbH
, Rüschlikon 8803, Switzerland
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B. Michel,
B. Michel
Zurich Research Laboratory,
IBM Research GmbH
, Rüschlikon 8803, Switzerland
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D. Poulikakos
D. Poulikakos
Department of Mechanical and Process Engineering, Laboratory of Thermodynamics in Emerging Technologies,
e-mail: dimos.poulikakos@ethz.ch
ETH Zurich
, Zurich 8092, Switzerland
Search for other works by this author on:
W. Escher
Zurich Research Laboratory,
IBM Research GmbH
, Rüschlikon 8803, Switzerland; Department of Mechanical and Process Engineering, Laboratory of Thermodynamics in Emerging Technologies, ETH Zurich
, Zurich 8092, Switzerland
T. Brunschwiler
Zurich Research Laboratory,
IBM Research GmbH
, Rüschlikon 8803, Switzerland
B. Michel
Zurich Research Laboratory,
IBM Research GmbH
, Rüschlikon 8803, Switzerland
D. Poulikakos
Department of Mechanical and Process Engineering, Laboratory of Thermodynamics in Emerging Technologies,
ETH Zurich
, Zurich 8092, Switzerlande-mail: dimos.poulikakos@ethz.ch
J. Heat Transfer. Aug 2010, 132(8): 081402 (10 pages)
Published Online: June 2, 2010
Article history
Received:
May 27, 2009
Revised:
January 28, 2010
Online:
June 2, 2010
Published:
June 2, 2010
Citation
Escher, W., Brunschwiler, T., Michel, B., and Poulikakos, D. (June 2, 2010). "Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips." ASME. J. Heat Transfer. August 2010; 132(8): 081402. https://doi.org/10.1115/1.4001306
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