... generation through the numerical example of a standard wafer electromigration accelerated test (SWEAT) structure with the measurement result is discussed. 22 08 2008 27 09 2009 04 03 2010 04 03 2010 electromigration failure analysis voids (solid) In semiconductor devices...

... microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis 29 04 2007 19 02 2008 18 02 2009 2009 American Society of Mechanical Engineers ...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

... fatigue finite element analysis flaw detection solders thermomechanical treatment voids (solid) Pb-free solder voids thermo-mechanical durability simulation energy partitioning successive initiation damage initiation damage propagation Voids originating during the manufacturing...

... cooling and heating ramps, respectively. Global FEA model for CTBAG132 and the critical ball at the outer corner 03 02 2006 08 09 2006 ball grid arrays durability finite element analysis reliability solders voids (solid) FEA voids lead-free thermomechanical...

... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...

... particles in bond pad aluminum metallization are the potential site of void nucleation. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids...

... to the outer rim, where they accumulate and coalesce to form big voids. 29 06 2004 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering...

... . 12 01 2004 18 05 2004 lead alloys silver alloys tin alloys solders flip-chip devices integrated circuit reliability microassembling integrated circuit packaging reflow soldering voids (solid) Flip-chip technology has been positioned as a key electronic packaging...

... voids (solid) 2003 ASME ...

... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...

... curing delamination voids (solid) This paper discusses a new method for rapid curing of encapsulants such as underfills in flip-chips using variable frequency microwaves (VFM). The VFM process offers several advantages as compared to convection oven cure. These include significant reduction...

... alloys soldering creep slip nucleation voids (solid) fatigue thermal stresses stress analysis viscoplasticity stress relaxation Eutectic Pb-Sn solder used in electronic packaging applications is known to be highly viscoplastic in use environments because of the high homologous...

... PACKAGING . Manuscript received by the EEPD June 21, 1999; revised manuscript received November 5, 1999. Associate Technical Editor: D. T. Read. 21 June 1999 05 November 1999 packaging thermal stress cracking composite material interfaces fatigue cracks voids (solid) fracture...

... 1999 integrated circuit packaging integrated circuit interconnections stress analysis inclusions voids (solid) internal stresses thermal stresses thermal stress cracking failure analysis Voiding and fracture of critical components in electronic packaging, such as passivated...

... capacitors ceramic packaging delamination reliability failure analysis acoustic microscopy ultrasonic materials testing flaw detection thermal stress cracking voids (solid) acoustic tomography Ceramic substrates play an extremely important role in electronic packages. Low temperature...