... generation through the numerical example of a standard wafer electromigration accelerated test (SWEAT) structure with the measurement result is discussed. 22 08 2008 27 09 2009 04 03 2010 04 03 2010 electromigration failure analysis voids (solid) In semiconductor devices...

... and SnAg solder is reliable. electroplating metallurgy scanning electron microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis SnAg solder bump reliability Flip-chip technology has been applied in interconnecting a large number...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

... solders thermomechanical treatment voids (solid) Pb-free solder voids thermo-mechanical durability simulation energy partitioning successive initiation damage initiation damage propagation Voids originating during the manufacturing process can be divided into the following...

... 2006 08 09 2006 ball grid arrays durability finite element analysis reliability solders voids (solid) Voids are one of the major categories of manufacturing defects in solder joints of electronic assemblies that can potentially degrade the reliability of interconnects. Voids can...

... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...

... deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding is a high yield, high speed automated...

... 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering In a flip chip assembly, the solder joints connecting the chip and its circuit...

... alloys silver alloys tin alloys solders flip-chip devices integrated circuit reliability microassembling integrated circuit packaging reflow soldering voids (solid) 12 01 2004 18 05 2004 Average void volume percentage of bump volume per defective bump as distributed by size...

... stress model could be developed based on the static stress simulation and fracture mechanics methodology could be applied in the model to make the simulation more accurate as well. microassembling packaging failure analysis delamination finite element analysis stress analysis adhesion voids...

... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...

.... Courtois. 15 February 2001 08 April 2002 10 06 2003 encapsulation flip-chip devices microwave heating polymers curing delamination voids (solid) This paper discusses a new method for rapid curing of encapsulants such as underfills in flip-chips using variable...

... alloys soldering creep slip nucleation voids (solid) fatigue thermal stresses stress analysis viscoplasticity stress relaxation Eutectic Pb-Sn solder used in electronic packaging applications is known to be highly viscoplastic in use environments because of the high homologous...

... composite material interfaces fatigue cracks voids (solid) fracture mechanics dislocation arrays Advanced microelectronic materials exhibit time-dependent degradation and failure under creep or cyclic loading conditions. For example, cracks may nucleate in microelectronic packages during thermal...

... by the EEPD June 23, 1998; revised manuscript received August 30, 1999. Associate Technical Editor: Y. C. Lee 23 June 1998 30 August 1999 integrated circuit packaging integrated circuit interconnections stress analysis inclusions voids (solid) internal stresses thermal stresses...

... ultrasonic materials testing flaw detection thermal stress cracking voids (solid) acoustic tomography Ceramic substrates play an extremely important role in electronic packages. Low temperature cofired ceramic (LTCC) technology has the ability to integrate passive components such as capacitors...