... process, reducing lead cost. 1 Corresponding author. e-mail:  aizatabas@usm.my 21 09 2024 28 01 2025 14 03 2025 convolutional neural network electronic packaging flip-chips underfill encapsulation voiding Convolutional neural network (CNN) is prevalent...

... package, while considering the filling time of the subsequent underfill encapsulation process. The design optimization approach was based on the latest regional segregation-based analytical filling time model. Numerical simulation was conducted to verify the governed analytical model. The discrepancies...

... of underfilling flow in encapsulation process Table 4 Classifications of analytical filling time models for the prediction of filling times of flip-chip underfill encapsulation process Classifications of analytical filling time models for the prediction of filling times of flip-chip underfill...

... analytical filling time model includes the filling time prediction of underfill encapsulation process and the optimizations of process and process design with future enhancement. The authors would like to gratefully acknowledge the financial support provided by Institute of Postgraduate Studies (IPS...