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Keywords: underfill encapsulant process
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Journal Articles

Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

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Muhammad Aqil Azman, Mohd Zulkifly Abdullah, Wei Keat Loh, Chun Keang Ooi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031002.
Paper No: EP-24-1099
https://doi.org/10.1115/1.4068143
Published Online: March 28, 2025
... pitch of 8, approximately 0.27 mm–0.29 mm, and a diameter of 4, approximately 0.13 mm–0.15 mm. This consistent patterning facilitates the comparative analysis of solder bump distribution effects on the underfill encapsulation process across the different chip configurations. 18 10 2024 25...
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Topics: Computational fluid dynamics, Flow (Dynamics), Simulation, Viscosity