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Journal Articles

Thermal Math Modeling and Analysis of an Electronic Assembly

Available to Purchase
K. N. Shukla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 372–378.
https://doi.org/10.1115/1.1388561
Published Online: May 5, 2000
...K. N. Shukla This paper presents a mathematical model for a three-dimensional thermal analysis of a circuit board with multiple heat dissipating sources. The model considers the three-dimensional flat plate with discrete surface heat sources and integral transform technique is employed to determine...
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Topics: Finite element methods, Heat, Heat transfer coefficients, Manufacturing, Mathematics, Modeling, Temperature, Temperature distribution, Thermal analysis, Printed circuit boards