... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys This work of authorship was prepared as an account...

... relevance. These were measured as outlined below. ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high...

... testing silver alloys solders tin alloys lead-free solder low-cycle fatigue strain rate effect creep strain stress relaxation cyclic loading Solder joints are subjected to cyclic inelastic deformation due to electronic parts having different coefficients of thermal expansion. Since...

... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys 09 12 2009 14 09 2010 23 11 2010 23 11 2010 The method described in Sec. 4 was applied to all the cyclic loadings...

... during solder spreading Arrhenius plot for the spreading of the Sn–37Pb solder 01 02 2010 03 10 2010 19 11 2010 19 11 2010 eutectic alloys interface phenomena lead alloys silver alloys solders surface roughness tin alloys wetting zinc alloys wetting...

... had a higher modulus, lower CTE, and slightly higher T g . 17 10 2009 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys The move...

... copper copper alloys electromigration failure analysis flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An earlier version of this paper...

... relations tensile testing tin alloys viscoplasticity lead-free solder alloy elasto-plastic-creep constitutive model time-independent deformation time-dependent deformation One significant problem in surface mounting technology is the differences in the coefficients of thermal expansion...

... vibration-induced strains are usually elastic. durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations 29 10 2007 05 12 2008 25 02 2009 Local 2D model for resistor component L C R component on the FEA...

... in Lead-Tin Alloys ,” Phys. Rev. B 0163-1829 10.1103/PhysRevB.28.579 , 28 ( 2 ), pp. 579 – 585 . Mei , Z. , Sunwoo , A. J. , and Morris , J. W. , 1992 , “ Analysis of Low-Temperature Intermetallic Growth in Copper-Tin Diffusion Couples ,” Metall. Trans. A 0360-2133 10.1007...

... integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys The DLS test vehicle has two solder joint arrays, each composed of nine joints, which are built into an aluminum alloy assembly such that, under tension...

... 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal diffusion tin alloys thermomigration lead-free hardness elastic modulus grain coarsening The insatiable demand...

... silver alloys solders tin alloys titanium vanadium 01 08 2007 07 01 2008 13 11 2008 2008 American Society of Mechanical Engineers ...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

.... 11 . At this load level, the affected indentation area was found to be smaller than the characteristic phase length scale measured from microstructure study ( 2 ). 12 05 2007 17 01 2008 29 07 2008 creep crystal microstructure silver alloys solders tin alloys...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling 2008 American Society of Mechanical Engineers ...

... 01 2008 copper alloys flip-chip devices printed circuits silver alloys solders tin alloys reliability flip chip thermal cycling micro-via Thermal excursions for electronic devices imparted during their operation can change the microstructure of their solder joints...

... silver alloys stress-strain relations tin alloys As technology progresses, more consumer and military products are making use of electronics to augment or enhance performance, and thus the use of electronics is increasing worldwide. Concurrently, there is an increased awareness to limit the use...

.... fatigue prediction lead-free solder electronic packaging copper alloys creep fatigue cracks finite element analysis plasticity silver alloys solders tin alloys 13 10 2006 19 07 2007 31 01 2008 Full model thermal profile, simulation substeps, and results of file...

... fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin alloys 2007 American Society of Mechanical Engineers ...