..., ceramic, and composite), and electronics package integration approaches, or conceptual fabrication workflows, are outlined for cold plates, heat sinks, fluid flow manifolds, and thermal interface materials (TIMs) plus composites for electronics. The current status of design optimization methods for AM...

... P ACKAGING . Manuscript received October 6, 2013; final manuscript received July 18, 2014; published online September 19, 2014. Assoc. Editor: Ashish Gupta. 06 10 2013 18 07 2014 A sensor is developed for simple, in situ characterization of dielectric thermal interface materials...

... Polymeric Thermal Interface Materials ,” IEEE Trans. Compon. Packag. Technol. 1521-3331 , 28 , pp. 230 – 237 . 10.1109/TCAPT.2005.848492 Covey , G. H. , and Stanmore , B. R. , 1981 , “ Use of the Parallel-Plate Plastometer for the Characterization of Viscous Fluids With a Yield Stress...

...Zongrong Liu; D. D. L. Chung Wax (predominantly tricosane paraffin wax, with a melting temperature of 48 ° C ) filled with hexagonal boron nitride (BN) particles ( 5 - 11 μ m ) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured...

...Yunsheng Xu; Xiangcheng Luo; D. D. L. Chung Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water and N, N-dimethylformamide for helping the dissociation...

...Xiangcheng Luo,; Yunsheng Xu, and; D. D. L. Chung Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper...