..., in which an aluminum wire delaminates from a silicon chip. The wire-liftoff phenomenon is a thermal fatigue failure caused by repeated temperature cycles during the operation of power modules. According to an experimental study, the wire-liftoff lifetime decreases with increase in the maximum junction...

... induce repeated thermal stress due to the mismatch in coefficients of thermal expansion (CTE) of the constituent materials. Thus, thermal fatigue phenomena are critical issues for the structural integrity of power modules. In the present paper, we also deal with the evaluation methodologies for thermal...

...Xiaoguang Huang; Zhiqiang Wang Thermal fatigue failure of microelectronic chip often initiates from the interface between solder and substrate, and the service life of the chip is largely dependent on the singular stress–strain at this interface. To provide a reasonable life evaluation method...

... microtomography system, the SP- μ CT has been developed at the Super Photon ring-8 GeV (SPring-8), the largest synchrotron radiation facility in Japan. In this work, the SP- μ CT was first applied to the nondestructive evaluation of thermal fatigue phenomena, namely microstructure evolution (i.e., phase growth...