... had a higher modulus, lower CTE, and slightly higher T g . 17 10 2009 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys The move...

... moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding flip chip bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics Research interest...

...Samson Yoon; Changsoo Jang; Bongtae Han A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat transfer, and stress analysis routines available...

... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...

... stresses stress analysis thermal expansion failure analysis elastic moduli encapsulation bending shrinkage finite element analysis Residual Stress Underfill Resins Bi-Material Strip Bending (BMSB) Finite Element Method Polymeric encapsulant plays a critical role in integrated...

... the stress exceeds ∼ 7 MPa . The relative dielectric constant is higher during loading than subsequent unloading. alumina permittivity electronics packaging compressive strength stress analysis thermal stresses Alumina (aluminum oxide, Al 2 O 3 ) is widely used for substrates...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 soldering lead bonding adhesion thermomechanical treatment stress analysis The reliability of solder...

... , “ The Order of Singularity at a Multi-Wedge Corner of a Composite Plate ,” Int. J. Eng. Sci. , Vol. 12 , pp. 107 – 120 . Lim , K. M. , Lee , K. H. , Tay , A. A. O. , and Zhou , W. , 2002 , “ A New Variable-Order Singular Boundary Element for Two-Dimensional Stress Analysis ,” Int. J...

...John H. Lau; Stephen H. Pan In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 optoelectronic devices glass stress analysis boundary-value problems packaging birefringence thermal expansion internal stresses thermal stresses In most...

... analysis, and the result was found that heat was transferred and spread from the die to the ACF and its conducting particle very quickly; in around 0.5 sec the ACF can reach the bonding temperature of 220°C. For the mechanical stress analysis of the conducting particle, the degree of the deformation...

... packaging metallisation thermal conductivity finite element analysis stress analysis thermal expansion substrates modelling internal stresses Semiconductor laser diodes are the primary components of various optoelectronic applications. Unlike the ordinary semiconductors, a laser...

... this technology to minimize package size and cost in a single package. Additionally, faster time to market and higher electrical functionality can be achieved in the same package size 1 2 . microassembling packaging failure analysis delamination finite element analysis stress analysis adhesion...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD September 1, 2000, Associate Editor: B. Michel. 01 September 2000 14 03 2003 piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations...

... to design a reliable package, it is important to understand stresses in the device, especially at interfaces. flip-chip devices interface phenomena stress analysis fracture finite element analysis packaging 20 December 2001 14 03 2003 Contributed by the Electronic...

... reliability stress analysis finite element analysis eigenvalues and eigenfunctions electronic engineering computing In order to meet the challenges of further miniaturization in electronic device packaging, a novel chip thinning technology has been developed in recent years 1 . This type...

.... Associate Editor: E. Suhir. 06 August 2002 12 12 2002 photonic switching systems soldering seals (stoppers) thermal analysis materials handling creep stress analysis finite element analysis fatigue testing tin alloys indium alloys thermal stress cracking packaging...

..., St. Paul MN, Issue No. 4. Iarve , E. V. , 1996 , “ Spline Variational Three Dimensional Stress Analysis of Laminated Composite Plates with Open Holes ,” Int. J. Solids Struct. , 33 ( 14 ), pp. 2095 – 2118 . Mollenhauer , D. , Ifju , P. , and Han , B. , 1994...

..., a direct-stress analysis method—referred to as the multi-domain method (MDM)—can be used to calculate effective local stiffness of ball grid array assemblies. The fast and accurate MDM is based on nested multi-field displacement superposition and is similar in concept to p-type FEM. It is similar...

... Bar-Cohen , A. , 1992 , “ State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment ,” ASME J. Electron. Packag. , 114 , pp. 257 – 270 . Ru , C. Q. , 2000 , “ Stress Analysis of Thermal Inclusions With Interior Voids and Cracks ,” ASME J. Electron. Packag. , 122...