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Keywords: slip
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 292–297.
Published Online: July 26, 2002
... alloys soldering creep slip nucleation voids (solid) fatigue thermal stresses stress analysis viscoplasticity stress relaxation Eutectic Pb-Sn solder used in electronic packaging applications is known to be highly viscoplastic in use environments because of the high homologous...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
Published Online: May 2, 2002
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 29, 2001. Associate Editor: B. Michel 29 May 2001 02 05 2002 eutectic alloys tin alloys lead alloys soldering plastic deformation recovery-creep integrated circuit packaging slip dislocation climb grain...
