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Keywords: sintering
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Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

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Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
...Yang Liu; Zhao Li; Min Zhou; Xianghua Zeng; Fenglian Sun Cu foam (Cu-F) and Ag-coated Cu-F were added into nano-Ag paste to obtain Cu-F@nano-Ag composite sintered joint. The microstructure, hardness, and shear behavior of the sintered joints were investigated. Experimental results indicated...
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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical Baffles

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Tzer-Ming Jeng, Sheng-Chung Tzeng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 226–235.
https://doi.org/10.1115/1.2229220
Published Online: August 18, 2005
...Tzer-Ming Jeng; Sheng-Chung Tzeng This work numerically examined the mechanism of heat transfer in a sintered porous heat sink with baffles. A channel filled with the sintered porous heat sink was asymmetrically heated and metallic baffles were periodically mounted on the heated surface. The fluid...
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Porous materials, Fluids, Reynolds number, Heat conduction
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

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Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
... the cooling down step of the sintering process. The technique of microindentation turned out to be a useful method to measure the stresses locally. The computations were done with three-dimensional finite element simulations. We find that the cooling step introduces compressive in-plane stresses...
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Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress