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Keywords: semiconductor device packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling High...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
... brightness computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Light-emitting diodes (LEDs) demonstrate a number...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
... semiconductor device packaging thermal management (packaging) thermal resistance thermal stability collector-up heterojunction bipolar transistor (C-up HBT) genetic algorithm (GA) optimization packaging thermal As claimed in a classical paper ( 1 ), an inverted transistor design...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book entitled “ Mechanical Design of Electronic Systems ” is written from a mechanical design perspective to introduce...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
Published Online: March 4, 2010
... semiconductor device packaging silicon stress effects residual stress piezoresistive gauge nMOSFET DC characteristics electron-mobility A semiconductor device is sometimes subjected to high residual stress during the packaging (resin-molding) process. This is due to the large mismatch...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
... circular stacked heat sink finite element analysis embedded heat pipe diamond copper composite thermal resistance semiconductor chip thermal management cooling finite element analysis heat pipes heat sinks semiconductor device packaging 16 10 2008 03 04 2009 14 07 2009...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2009, 131(1): 014501.
Published Online: February 12, 2009
... provides specific information about the thermal path being influenced by the chimney. 25 04 2008 01 07 2008 12 02 2009 cooling natural convection semiconductor device packaging thermal conductivity thermal management (packaging) thermal resistance transistors The use...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
Published Online: December 14, 2006
... nanoelectronics transistors semiconductor device packaging ballistic transport thermal analysis The technological revolution that started with the introduction of the transistor just over half a century ago is without parallel in the way it has shaped our economy and our daily lives. The current trend...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 208–214.
Published Online: August 26, 2005
... significantly lower operating temperatures under the same double-sided cooling condition. After considering the operating temperature difference, the DS package was shown to be superior over the SB package in the power cycling analysis. 03 01 2005 26 08 2005 semiconductor device packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 267–272.
Published Online: August 15, 2005
... their implications on the design of the system. 13 06 2005 15 08 2005 power MOSFET modules semiconductor device packaging cryogenic electronics cooling Recently, extensive research has been focused on the development of cryogenic power electronics system. Because certain semiconductor...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
Published Online: March 21, 2005
... that is positioned at the outermost V-groove in the array, cannot be ignored. Manuscript received January 7, 2004; revision received August 13, 2004. Review conducted by: Y. C. Chan. 07 January 2004 13 August 2004 21 03 2005 silicon elemental semiconductors semiconductor device...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
... April 2004 22 June 2004 24 01 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat transfer temperature control rods (structures) flow simulation IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first...
Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
Published Online: January 24, 2005
... management (packaging) semiconductor device packaging product development quality management reliability safety electronics industry Thermal Characterization Compact Modeling Dynamic Measurements Test Dies Reliability Many roadmaps recognize thermal management as one of the major...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy storage is one of three available ways to store heat, the other two methods being sensible heat energy...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 135–141.
Published Online: April 30, 2004
..., the two failure mechanisms can be interrelated, especially when interface cracking is in close proximity to the solder connections. solders cracks semiconductor device packaging viscoplasticity plastic deformation fracture internal stresses 01 March 2003 01 November 2003 30...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 313–318.
Published Online: September 17, 2003
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 4, 2001. Associate Editor: B. Courtois. 04 December 2001 17 09 2003 ceramic insulation ceramic packaging semiconductor lasers semiconductor device...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
Published Online: June 10, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham. 22 June 2001 10 06 2003 integrated circuit packaging semiconductor device packaging optoelectronic devices thermal stresses thermal expansion...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 419–426.
Published Online: December 12, 2002
... device packaging heat transfer natural convection temperature measurement simulation transients Advances in the packaging of portable electronic devices (cellular phones, laptop computers, etc.) reduce their size per consumer demand; consequently, the external surface area available for heat...