... that comparisons of test results may not reflect relative performances under service conditions. This was illustrated with for a set of model BGA components with 20 mil (0.5 mm) diameter SAC305 solder balls, which were reflow soldered onto printed circuit boards using a eutectic SnPb solder paste and tested...

...) of δ . The distributed forces acting on the edges of the die are resolved into the direction of δ . 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer...

... of the various approaches are mutually consistent. 29 12 2004 29 09 2005 flip-chip devices reflow soldering solders surface tension eutectic alloys The cross section of the specimen Throughout the following cases except as specified, the radii of the upper and lower pads...

...W. K. Chiang; Y. C. Chan This paper presents the reliability of anisotropic conductive film (ACF) joint tested under reflow soldering and environmental test effect. The ACF joint behaved differently under different reflow soldering profiles. The lower reflow temperature resulted in more reliable...

... ,” Appl. Numer. Math. , 40 (1–2), pp. 101 – 117 . Manuscript received May 2003; final revision, April 2004. Review conducted by: B. Sammakia. 01 May 2003 01 April 2004 24 01 2005 solders reflow soldering flip-chip devices curing chip scale packaging integrated...

... of the package was 892 h, and the average ultimate service time of the package was 1053 h. 17 08 2004 13 01 2005 metallisation reliability integrated circuit packaging reflow soldering testing tin aluminium alloys nickel alloys vanadium alloys copper alloys dies (machine tools...

.... , and Lai , J. K. L. , 1995 , “ Characteristics of Porosity in Solder Pastes During Infrared Reflow Soldering ,” J. Mater. Sci. 0022-2461 10.1007/BF00351571 , 30 ( 21 ), pp. 5543 – 5550 . Goenka , L. , and Achari , A. , 1995 , “ Void Formation in Flip-Chip Solder Bumps—Part I...

.... , Chan , Y. C. , and Hung , K. C. , 2002 , “ Reaction Kinetics of Pb–Sn and Sn–Ag Solder Balls With Electroless Ni–P∕Cu Pad During Reflow Soldering in Microelectronic Packaging ,” ECTC, pp. 1650 – 1657 . Jeon , Y. , and Paik , K. , 2001 , “ Studies on Ni–Sn compound and P rich...

... on solder joint shape are then analyzed. Recommendations are provided on ways to maximize standoff height and avoid bridging. Finally, the formation of leadless solder joints is studied and compared to experimental data. ball grid arrays integrated circuit reliability viscoelasticity reflow soldering...

... , “ Voiding in BGA at Solder Bumping Stage ,” ISHM Proceedings of Microelectronics and Packaging Conference , Philadelphia, PA, pp. 462 – 471 . Chan , Y. C. , Xie , D. J. , and Lai , J. K. L. , 1995 , “ Characteristics of Porosity in Solder Pastes during Infrared Reflow Soldering ,” J...

... . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 reflow soldering surface tension wetting thermomechanical treatment reliability A review of the literature on solder joint reliability suggests that there has been significant research...

.... The final component of the solder paste is the vehicle system which provides suspending power for alloy particles and designated paste rheology (Hwang 1 ). reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting solidification cooling...

... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...

... mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection 2003 ASME ...

.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 3, 2001. Associate Editor: Y.-H. Pao. 03 December 2001 14 03 2003 flip-chip devices reflow soldering inspection...

... tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion crystallisation solidification ageing 6 The relative magnitudes of D b δ / d , D l , and D app versus temperature The relative...

... , A. , and Nishi , K. , 1989 , “ A Study of Package Cracking During the Reflow Soldering Process ” (in Japanese), Trans. Jpn. Soc. Mech. Eng., Ser. A , 55 ( 510 ), pp. 356 – 363 . Hattori , T. , Nishimura , A. , and Murakami , G. , 1990 , “ A Stress Singularity Parameter Approach...

...Noriyasu Kawamura; Takashi Kawakami; Kikuo Kishimoto; Masaki Omiya; Toshikazu Shibuya Plastic encapsulated semiconductor packages may crack at the corner regions of die pads or chips if internal delamination occurs at an elevated temperature during the reflow soldering process. Thus, the structural...

... 12 2002 flip-chip devices integrated circuit interconnections encapsulation integrated circuit packaging plastic packaging shear strength heat treatment interface structure reflow soldering surface chemistry As the trend in requirements of electronic packaging is toward...

..., due to stresses caused by the underfill swelling. Optimizing the choice of the underfill is thus crucial to the reliability of FCOB assemblies. flip-chip devices chip-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element...