... that comparisons of test results may not reflect relative performances under service conditions. This was illustrated with for a set of model BGA components with 20 mil (0.5 mm) diameter SAC305 solder balls, which were reflow soldered onto printed circuit boards using a eutectic SnPb solder paste and tested...

... 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder wetting dynamics While next generation flip chip processing holds many...

... of the various approaches are mutually consistent. flip-chip devices reflow soldering solders surface tension eutectic alloys Comparison of the solder joint geometric parameters with different surface tensions γ l Comparison of the solder joint geometric parameters...

...W. K. Chiang; Y. C. Chan This paper presents the reliability of anisotropic conductive film (ACF) joint tested under reflow soldering and environmental test effect. The ACF joint behaved differently under different reflow soldering profiles. The lower reflow temperature resulted in more reliable...

... interconnection with underfill entrapment. Our modeling results show good agreement with the experiment that shows underfill entrapment can actually increase the fatigue lifetime of the no-flow flip chip package. solders reflow soldering flip-chip devices curing chip scale packaging integrated circuit...

... of the package was 892 h, and the average ultimate service time of the package was 1053 h. 17 08 2004 13 01 2005 metallisation reliability integrated circuit packaging reflow soldering testing tin aluminium alloys nickel alloys vanadium alloys copper alloys dies (machine tools...

.... , and Lai , J. K. L. , 1995 , “ Characteristics of Porosity in Solder Pastes During Infrared Reflow Soldering ,” J. Mater. Sci. 0022-2461 10.1007/BF00351571 , 30 ( 21 ), pp. 5543 – 5550 . Goenka , L. , and Achari , A. , 1995 , “ Void Formation in Flip-Chip Solder Bumps—Part I...

...°C. An electrolytic Ni ∕ solder system has a relatively higher shear load, a lower dissolution rate of the Ni layer, and is more protective for the Cu layer during extended times of reflow. 05 08 2003 22 12 2004 ball grid arrays reflow soldering solders reliability nickel...

... and Pedestal Heights of Solder Joints for Leadless Chip Components ,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A 1070-9886 , Part A 19 ( 2 ), pp. 224 – 233 . 18 04 2004 05 10 2004 ball grid arrays integrated circuit reliability viscoelasticity reflow soldering surface...

... devices integrated circuit reliability microassembling integrated circuit packaging reflow soldering voids (solid) Flip-chip technology has been positioned as a key electronic packaging technology to meet the requirement of low-cost, lightweight, small size, and high-performance devices ( 1...

.... 01 June 2003 30 04 2004 reflow soldering surface tension wetting thermomechanical treatment reliability A review of the literature on solder joint reliability suggests that there has been significant research activity on solder joint integrity from the perspective...

... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division February 21, 2002. Associate Editor: R. Wirtz. 21 February 2002 17 09 2003 reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting...

... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...

... 19, 2002. Associate Editor: Y.-H. Pao. 19 March 2002 14 03 2003 copper alloys tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion crystallisation solidification ageing Plastic BGA Solder Joint Cooling Rate Cu-Sn...

... surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology PBGAs provide superior electrical performance, such as lower inductance and higher density of I/O...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 3, 2001. Associate Editor: Y.-H. Pao. 03 December 2001 14 03 2003 flip-chip devices reflow soldering inspection quality control light...

... moulding plastic packaging integrated circuit packaging delamination thermal stress cracking bending finite element analysis reflow soldering failure analysis Plastic packaging is the most popular technique in electronic packaging because of its low costs and ease of manufacture. However...

...Noriyasu Kawamura; Takashi Kawakami; Kikuo Kishimoto; Masaki Omiya; Toshikazu Shibuya Plastic encapsulated semiconductor packages may crack at the corner regions of die pads or chips if internal delamination occurs at an elevated temperature during the reflow soldering process. Thus, the structural...

... 3 . The thickness of the IMC increases linearly from 0.97 to 1.34 μm with the increasing heating factor Q n from 160 to 6386 s°C. It is found that most of the Cu 6 Sn 5 are of chunky type. 2 Cross section of a reflowed solder joint In our experiment...

... Editor: S. M. Heinrich. 26 07 2002 integrated circuit reliability ball grid arrays reflow soldering thermal stress cracking plastic packaging integrated circuit modelling integrated circuit packaging Reliability is one of the major concerns for ball grid array (BGA...