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Keywords: printed circuit manufacture
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
Published Online: July 30, 2008
... 01 02 2008 30 07 2008 assembling elasticity finite element analysis plasticity press fitting printed circuit manufacture press-fit assembly solderless technology finite element analysis elastic-plastic properties friction coefficient Due to concerns about...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 205–215.
Published Online: July 23, 2006
... printed circuit manufacture cooling electronics packaging convection substrate printed circuit boards (PCB) heated modules Vertical two-dimensional channels formed by pair of parallel plates (cards or fins) are frequently encountered configuration for air cooled...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
Published Online: February 23, 2006
... a is the total crack length (pad diameter). 05 10 2005 23 02 2006 assembling surface mount technology printed circuit manufacture ball grid arrays chip scale packaging finite element analysis bending failure analysis solders materials testing reliability The increasing...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 282–287.
Published Online: October 6, 2004
... circuit testing printed circuit manufacture finite element analysis thermoelasticity printed circuit design Printed circuit boards (PCB’s) are generally constructed using two types of routing strategies depending on the complexity of a design: X-Y or Maze routing. As shown in Fig. 1 , the X-Y...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
Published Online: July 17, 2004
... and effectively modeled using the standard implicit time-integration code. 10 05 2004 17 07 2004 printed circuit manufacture electronics packaging bending finite element analysis heat transfer Electronic Packaging Drop Impact Dynamics Finite Element There has been increasing...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2004, 126(1): 173–176.
Published Online: April 30, 2004
... production planning manufacturing processes assembling soldering surface mount technology fine-pitch technology printed circuit manufacture integrated circuit reliability laser beam applications 01 March 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
Published Online: September 17, 2003
.... The final component of the solder paste is the vehicle system which provides suspending power for alloy particles and designated paste rheology (Hwang 1 ). reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting solidification cooling...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
..., 2002. Associate Editor: Y.-H. Pao. 19 March 2002 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection PBGAs provide...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
Published Online: March 14, 2003
... . Manuscript received by the EPPD Division, December 3, 2001. Associate Editor: S. M. Heinrich. 03 December 2001 14 03 2003 fracture mechanics soldering printed circuit manufacture fatigue cracks packaging Solder grid arrays (SGA) and the related ball grid arrays (BGA) have...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
Published Online: December 12, 2002
..., May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 adhesives surface mount technology printed circuit manufacture Taguchi methods design of experiments mechanical properties conducting polymers Electronic devices manufacturers...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
Published Online: July 26, 2002
.... Associate Editor: Yi-Hsin Pao. 09 August 2000 26 07 2002 reflow soldering flip-chip devices creep chip scale packaging printed circuit manufacture integrated circuit reliability life testing integrated circuit testing By IPC’s definition, holes with 6 mils (0.15 mm...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
Published Online: July 26, 2002
... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
Published Online: July 26, 2002
... stress cracking printed circuit manufacture life testing production testing fracture mechanics finite element analysis creep fracture chip scale packaging reflow soldering There are at least two major reasons why directly attaching the solder bumped flip chip on PCB is not popular yet 1...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 45–53.
Published Online: January 1, 2001
... thermal analysis wave soldering printed circuit manufacture stress analysis cooling circuit reliability Integrity of plated through holes (PTHs), as shown in Fig. 1 , has become one of the primary printed wiring board (PWB) reliability concerns either during the component assembly process...