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Keywords: porous materials
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
Published Online: September 23, 2005
... configuration for even larger enhancement in heat transfer. 25 05 2005 23 09 2005 heat sinks cooling electronics packaging convection porous materials metal foams aluminium Horton , C. W. , and Rogers , F. T. , 1945 , “ Convection Currents in Porous Media ,” J. Appl...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 226–235.
Published Online: August 18, 2005
... and various w ∕ H as well as X L , at Re > 3000 , sintered porous heat sinks with baffles insignificantly improved heat transfer. 06 02 2005 18 08 2005 heat sinks porous materials heat transfer sintering heat conduction integrated circuit packaging thermal management (packaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 127–134.
Published Online: June 1, 2004
... in this study is an open-cell porous material that consists of a network of interconnected graphite ligaments whose thermal conductivities are up to five times higher than copper. While the bulk graphite foam has a thermal conductivity similar to aluminum, it has one-fifth the density, making it an excellent...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
... liquid crystal method 08 04 2004 08 05 2004 heat conduction porous materials aluminium foams air forced convection heat sinks modelling flow through porous media Porous Metallic Foam Heat Sink Single Blow Method Transient Liquid Crystal Method Nusselt Number...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...