... new avenues for heterogeneous integration of electronics. This article thus provides a review of AM methods and applications in the specific context of thermal solutions for heterogeneous integration of electronics. Three-dimensional printing methods, associated materials (e.g., metal, polymer...

... and 33 °C with moisture absorption. This could be due to the presence of water molecules forming hydrogen bonds with the polymeric chains, increasing the distance, and loosening the intersegmental forces between polymer chains, resulting in a lower T g . This is also known as the plasticizing effect...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 3, 2001. Associate Editor: Z. Suo. 03 May 2001 26 07 2002 filled polymers particle reinforced composites thermal resistance packaging cooling Polymer...