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Keywords: particle size
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Journal Articles
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds
Available to PurchaseSanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
Published Online: September 15, 2021
... be strongly enhanced by subsequent work hardening in mild cycling. microjoints heat sinks copper nanoparticles rapid sintering porosity particle size macroscopic strain inelastic deformation impression creep test diffusion creep dislocations annealing coarsening surface diffusion oxidation...
Journal Articles
Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
Published Online: June 7, 2011
... analysis of the particle size distributions in pristine and functionalized graphite nanoplatelets based on scanning electron microscopy showed an increasing degree of exfoliation of the functionalized material. We compare the performance of the functionalized graphite nanoplatelets and carbon nanotubes...
Journal Articles
High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 469–472.
Published Online: April 4, 2007
... N 4 particle filled epoxy composite with a novel structure was fabricated by a processing method and structure design. Epoxy resin used in particle form was obtained by premixing and crushing. Different particle sizes were selected by sieving. High thermal conductivity was achieved at relative low...
Journal Articles
Effect of Bonding Force on the Conducting Particle With Different Sizes
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
... was increased as the bonding force increased. The conducting particle was subjected to the larger stress level as the smaller of the particle size. The stress concentration was located at the edge area and diminished at the center area. It was also found that the cracks were found at the four corners...