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Keywords: offset strip fin
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2014, 136(2): 024501.
Paper No: EP-13-1058
Published Online: April 29, 2014
... of electronic chips. The heat is transported by conduction through plastic and copper-invar layers. Finally, the heat is rejected by a forced air stream in the center of the unit. The channel system for the cooling air is designed as an offset strip fin surface. A three-dimensional numerical method based...
