... optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray...

.... The development of nondestructive testing methods with high spatial resolution is expected to enhance reliability. An X-ray microtomography system called SP - μ CT has been developed in Super Photon ring-8 GeV (SPring-8), the largest synchrotron radiation facility in Japan. In this work, SP - μ CT was applied...

... 2003 01 January 2004 08 07 2004 solders failure (mechanical) finite element analysis nondestructive testing CCD image sensors electronics packaging For realistic design, reliability and failure analysis of materials such as solders for problems in electronic packaging...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 internal stresses laminates light interferometry moire fringes nondestructive testing stress analysis The subject of residual stress due to coefficient...

... atomic force microscopy integrated circuit reliability nondestructive testing correlation methods flip-chip devices image processing crack detection Quality and suitability of thermo-mechanical design and optimization of advanced electronic packages by means of finite element analysis (FEA...

... by the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 shrinkage adhesives nondestructive testing...