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Journal Articles

Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

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Muhammad Aqil Azman, Mohd Zulkifly Abdullah, Wei Keat Loh, Chun Keang Ooi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031002.
Paper No: EP-24-1099
https://doi.org/10.1115/1.4068143
Published Online: March 28, 2025
... 02 2025 28 03 2025 1 Corresponding author. e-mail:  mezul@usm.my multi-chip underfill encapsulant process CFD heterogenous integration References [1] Zhang , S. , Li , Z. , Zhou , H. , Li , R. , Wang , S. , Paik , K.-W. , and He , P. , 2022...
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Topics: Computational fluid dynamics, Flow (Dynamics), Simulation, Viscosity