...Jin Yang; I. Charles Ume Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important...

... devices ball grid arrays chip scale packaging soldering inspection modal analysis finite element analysis vibration measurement light interferometry photoacoustic effect measurement by laser beam Solder bump technology has been proven to be a reliable interconnection method in many...

... study demonstrates the difference between linear and nonlinear analysis in characterizing the PWB dynamic response under various loading conditions. Nonlinear resonance with significant deflection is observed under certain excitation frequencies. The modal analysis justified the fundamental mode...

... by the EEPD July 13, 1999; revised manuscript received February 25, 2000. Associate Technical Editor: B. Michel. 13 July 1999 25 February 2000 vibrations modal analysis supports optimisation printed circuit design In many engineering structures, one is normally interested...