... are also included in the superposition results, which makes it possible to model a large number of transistors on a silicon chip. The capabilities of the proposed methodology are demonstrated through a case study involving thermal modeling and analysis of a microprocessor chip with 4 × 10 6 transistors...

... microprocessor chips temperature control thermal resistance Data center cooling thermal management chip to cooling tower energy efficiency heat sink © 2010 IEEE. Reprinted with permission from the “12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic...

... Investigations of ICs and Systems SIA . 2005 , International Technology Roadmap for Semiconductors. Mahajan , R. , Chiu , C. -P. , and Chrysler , G. , 2006 , “ Cooling a Microprocessor Chip ,” Proc. IEEE 0018-9219 , 94 ( 8 ), pp. 1476 – 1486 . 10.1109/JPROC.2006.879800 Zhiping...

... engineering computing microprocessor chips sensitivity analysis thermodynamics ubiquitous computing The use of computers and the internet has become startlingly pervasive in today’s society. Not surprisingly this has an impact on our societal infrastructure with respect to providing the requisite...

... logic circuits microprocessor chips numerical analysis temperature distribution As the performance of microprocessor increases, the need to supply data and instructions to the core processor increases accordingly. In the past, this information, which normally resides in main memories...

...% tolerance 10 × voltage divider. All sensor data was digitally recorded using an Agilent E8408A VXI mainframe with an E1413C 64 channel 16 bit A/D converter. coatings cooling electronics packaging evaporation heat conduction microprocessor chips pool boiling microporous...

... and thermohydraulic performance evaluation of high heat flux evaporators suitable for interfacing the microprocessor chip with a cascaded R134a∕R508b vapor compression refrigeration system at − 80 ° C . Four compact evaporator designs are examined—a base line slit-flow structure with no microfeatures, straight...

... device can be easily retrofitted into existing systems; improving performance without major channel and/or fan modifications. 10 12 2004 16 02 2006 thermal management (packaging) heat sinks microprocessor chips integrated circuit packaging forced convection The state...

... performance will be hindered by the need for large power supplies and high-capacity heat rejection systems. 27 04 2005 06 12 2005 microprocessor chips power consumption electronics packaging exergy exergy energy efficiency information processing brain information processing...

... possible configurations for the solution presented. 29 07 2004 18 05 2005 heat sinks thermal management (packaging) chip scale packaging heat conduction thermal conductivity microprocessor chips Thermal management of electronic packages and systems is one of the key technical...

... 2004. Associate Editor: W. King. 01 August 2003 01 April 2004 06 10 2004 microprocessor chips thermal resistance integrated circuit packaging flip-chip devices thermal stresses temperature distribution cooling flow simulation In the past decade, simulation...

... packaging flow simulation finite element analysis microprocessor chips compressible flow encapsulation viscosity chip-on-board packaging 05 April 1999 17 August 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC...