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Keywords: metals
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 23–29.
Published Online: May 11, 2005
...M. Bahrami; M. M. Yovanovich; E. E. Marotta A compact analytical model is proposed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The model assumes plastic deformation at microcontacts and joint temperatures less than the polymer’s glassy temperature...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2002, 124(2): 127–134.
Published Online: May 2, 2002
...Qizhou Yao; Jianmin Qu Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, cohesive failure near the interface is usually desired for enhancing...