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Keywords: metal
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
Published Online: February 20, 2025
... new avenues for heterogeneous integration of electronics. This article thus provides a review of AM methods and applications in the specific context of thermal solutions for heterogeneous integration of electronics. Three-dimensional printing methods, associated materials (e.g., metal, polymer...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 64–69.
Published Online: July 13, 2000
...Zongrong Liu; D. D. L. Chung Air-firable glass-free metal electrically conductive thick film pastes of different compositions were developed by using a titanium alloy component, and tin and zinc metal substitutes for glass frit used in traditional thick film pastes. The effect of different...