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Keywords: lead-free soldering
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021001.
Paper No: EP-24-1080
Published Online: December 9, 2024
... the Anand model on the mechanical behavior of SAC lead-free solders using nonlinear thermomechanical simulations. This section presents the findings from the thermomechanical simulations. The activation energy ( Q ) value is a very important parameter that substantially affects the response...
