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Keywords: inverted packaging
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021002.
Paper No: EP-20-1041
Published Online: August 27, 2020
...Zong-Tao Li; Jia-Yong Liang; Jia-Sheng Li; Jie-Xin Li; Yong Tang Inverted packaging structure is a promising alternative for thermal isolation between light-emitting diode (LED) chips and quantum dot (QD) converters with effective heat dissipation. However, serious reflection loss occurs...