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Keywords: interface phenomena
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
... activation energy eutectic alloys interface phenomena lead alloys silver alloys solders surface roughness tin alloys wetting zinc alloys 01 02 2010 03 10 2010 19 11 2010 19 11 2010 Arrhenius plot for the spreading of the Sn–37Pb solder 2010 American...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 582–588.
Published Online: December 15, 2003
.... 01 November 2002 15 12 2003 soldering alloys fatigue chip scale packaging deformation thermal shock stress-strain relations viscoplasticity interface phenomena failure analysis Solder joint fatigue failure was one of the common failure mechanisms occurring in electronic...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 44–52.
Published Online: March 14, 2003
... interface phenomena stress analysis fracture finite element analysis packaging 20 December 2001 14 03 2003 Contributed by the Electronic and Photonic Packaging Division for publication in the Journal of Electronic Packaging. Manuscript received by the EPPD Division, December 20, 2001...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
Published Online: March 14, 2003
... deformation interface phenomena modelling The development of advanced electronic packages must address the need for miniaturization, low cost, and increased performance in emerging electronic products. Flip chip technology is a rapidly growing technique for achieving these needs. However...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2001, 123(4): 406.
Published Online: December 1, 2001
...Chandrakant S. Desai,, Author; Antonio Gens,, Reviewer interface phenomena civil engineering mechanics Mechanics of Materials and Interfaces: The Disturbed State Concept , by Chandrakant S. Desai, CRC Press LLC, Boca Raton, Florida, USA 2001, 698 pp. Describing the behavior...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 27–36.
Published Online: March 13, 2001
... interface phenomena packaging Since a thermocompression wire bonding was pioneered in Bell Laboratories (Anderson 1 and Christensen 2 ), the wire bonding has been one of indispensable microjoining techniques to the electronic packaging, because of its flexibility for the change in the design...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 128–131.
Published Online: December 28, 1999
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD July 27, 1999; revision received December 28, 1999. Associate Technical Editor: D. Agonafer. 27 July 1999 28 December 1999 sodium compounds thermal conductivity interface phenomena Insufficiently fast...