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Keywords: integrated circuit packaging
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
Published Online: December 9, 2011
... to and from the refrigerant. ( a ) Schematic and ( b ) actual setup of a miniature vapor compression heat pump microelectronics cooling solution [( 33 )] integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 3D chip stacks thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
... of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers,” ASME J. Electron. Packag. 132 (2), p. 024501). 18 05 2010 25 05 2011 14 09 2011 14 09 2011 cooling graphs integrated circuit packaging thermoelectricity Thermoelectric...
Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041014.
Published Online: December 9, 2010
... ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography 29 07 2009 09 08 2010 09 12...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021008.
Published Online: June 25, 2010
...) and operating at higher clock speed, higher Δ T can be realized. Based on this paper’s analysis, the optimized scenario resulted in a junction temperature of 56.6 ° C at the cost of a 14% performance loss. delays integrated circuit packaging microprocessor chips minimisation thermal management (packaging...
Journal Articles
Journal Articles
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... 19 03 2010 19 03 2010 integrated circuit design integrated circuit packaging integrated circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book...
Journal Articles
Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011001.
Published Online: February 25, 2010
... accuracy. Special attention is made to analyze and eliminate the possible sources of measurement inaccuracy. A number of measurement examples prove the usability of the developed measuring instrument. 19 01 2009 20 05 2009 25 02 2010 25 02 2010 integrated circuit packaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
Published Online: November 12, 2009
... circuit packaging microfabrication microsensors Taguchi methods glass cover chip CMOS image sensor Taguchi method packaging process Rapid technological advancements in the semiconductor field, combined with growing consumer demand for products with increasing levels of functionality...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
Published Online: November 12, 2009
... in package geometries. integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging industry primarily relies on the tried and trusted technique of imposing...
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...
Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys The DLS test vehicle has two solder joint arrays, each composed of nine joints, which are built into an aluminum alloy assembly such that, under tension...
Journal Articles
Journal Articles
Journal Articles