... management challenges, and advanced 2D thermal management solutions are discussed. 04 06 2010 18 07 2011 09 12 2011 09 12 2011 integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 3D chip stacks thermal management through...

... graphs integrated circuit packaging thermoelectricity Thermoelectric cooler design COP performance 3D TEC system analysis In recent years, cooling high heat flux systems such as computer microprocessors, logic memory, and power supplies have become a global challenge because future...

...- induced stresses dominate. 31 03 2010 06 06 2011 14 09 2011 14 09 2011 finite element analysis integrated circuit packaging integrated circuit reliability Raman spectroscopy three-dimensional integrated circuits Cross section of the 3D stack used for global model...

... ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography 29 07 2009 09 08 2010 09 12...

... of various functional units with distinct powers, frequencies, and operating voltages. delays integrated circuit packaging microprocessor chips minimisation thermal management (packaging) 28 10 2009 03 05 2010 25 06 2010 25 06 2010 2010 American Society...

.... The only difference between passive and active solid-state cooling is the utilization of a thermoelectric module (TEM) sandwiched between the processor and the passive or active heat sink. cooling integrated circuit packaging integrated circuit reliability thermal management (packaging...

...John H. L. Pang Mechanical Design of Electronic Systems ,by Dally James W. Lall Pradeep Suhling Jeffrey C. . College House Enterprises, LLC , Knoxville, TN , 2008 19 03 2010 19 03 2010 integrated circuit design integrated circuit packaging integrated...

... circuit packaging joining processes anisotropic conductive adhesives (ACAs) copper anti-oxidant silane coupling agent electrical contact resistance reliability Electrically conductive adhesives (ECAs) have been extensively used for interconnection and joining materials...

... computational model for the simulation of practical epoxy molding compound encapsulation. 12 08 2007 28 09 2009 04 03 2010 04 03 2010 encapsulation finite difference methods integrated circuit packaging moulding plastic packaging semiconductor process modelling two-phase flow...

... accuracy. Special attention is made to analyze and eliminate the possible sources of measurement inaccuracy. A number of measurement examples prove the usability of the developed measuring instrument. 19 01 2009 20 05 2009 25 02 2010 25 02 2010 integrated circuit packaging...

... , Tokyo . Park , S. H. , 1996 , Robust Design and Analysis for Quality Engineering , Chapman & Hall , London . 2006 , http://www3.sympatico.ca/peter_budgell/ 18 04 2008 15 05 2009 12 11 2009 12 11 2009 CMOS image sensors integrated circuit packaging...

... geometry are proposed. 02 10 2008 14 06 2009 12 11 2009 12 11 2009 integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging...

... reflow electronic package multiscale analysis diffusion integrated circuit packaging moisture numerical analysis vapour pressure 09 01 2008 22 03 2009 31 07 2009 Material properties at 60 ° C / 60 % RH 60 ° C / 60 % RH Mat1 Mat2...

... reflow chip scale package soft film cavitation unstable void growth wafer level film (WLF) cohesive failure die-attach desorption diffusion integrated circuit packaging moisture vapour pressure 18 09 2008 22 03 2009 31 07 2009 2009 American Society of Mechanical...

...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...

... sinks integrated circuit packaging micropumps thermal management (packaging) hot spots liquid cooling As the power of microprocessors has steadily increased, keeping pace with Moore’s law, there has been an accompanying need to remove increasingly larger average heat fluxes approaching...

.... 0361-5235 10.1007/s11664-004-0169-8 , 33 ( 11 ), pp. 1389 – 1400 . 08 08 2007 09 08 2008 13 02 2009 ball grid arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging...

... the equations for various surfaces to calculate the maximum junction temperature for a given multilayer body. Finally validation of the analytical solution is carried out using previously developed numerical model. 18 11 2007 15 05 2008 12 02 2009 integrated circuit packaging integrated...

... thickness. 10 03 2008 06 05 2008 11 02 2009 heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance optimized thickness rectangular plate orthotropic thermal conductivity analytical solution...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...