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Keywords: infrared
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021003.
Paper No: EP-13-1064
Published Online: April 29, 2014
... micropin fin sinks. Results of this experimental study may be used for designing the cooling high power laser and rocket-born electronic devices. pin-fin microchannel varying high heat flux chip cooling infrared Breakthroughs in many of today's technologies are becoming increasingly...
