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Keywords: indium alloys
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Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
Published Online: March 21, 2005
... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... . Manuscript received June 2003; final revision, February 2004. Associate Editor: D. Agonafer. 01 June 2003 01 February 2004 06 10 2004 copper transient analysis metal foams bismuth alloys tin alloys lead alloys indium alloys heat sinks thermal management (packaging) thermal...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
Published Online: December 12, 2002
... systems soldering seals (stoppers) thermal analysis materials handling creep stress analysis finite element analysis fatigue testing tin alloys indium alloys thermal stress cracking packaging The fundamental principles, design concepts, engineering developments and recent advances...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
Published Online: July 26, 2002
..., New York, NY, 2001, 519 pp., $79.95, ISBN: 0 07 134417 9 soldering lead materials properties bismuth alloys silver alloys indium alloys surface cleaning 2002 ASME ...