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Journal Articles

Adhesive Joining Process and Joint Property With Low Melting Point Filler

Kiyokazu Yasuda, Jong-Min Kim, Kozo Fujimoto
Journal: Journal of Electronic Packaging
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
DOI: https://doi.org/10.1115/1.1846060
Published Online: March 21, 2005
... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...
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Topics: Adhesives, Alloys, Fillers (Materials), Heat conduction, Melting point, Resins, Joining, Copper, Epoxy resins, Self-organization
Journal Articles

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

Shankar Krishnan, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
DOI: https://doi.org/10.1115/1.1772411
Published Online: October 6, 2004
... Editor: D. Agonafer. 01 June 2003 01 February 2004 06 10 2004 copper transient analysis metal foams bismuth alloys tin alloys lead alloys indium alloys heat sinks thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature...
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Topics: Copper, Heat sinks, Junctions, Melting, Phase change materials, Temperature, Thermal conductivity, Transients (Dynamics), Thermal management, Energy storage
Journal Articles

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan
Journal: Journal of Electronic Packaging
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
DOI: https://doi.org/10.1115/1.1512294
Published Online: December 12, 2002
.... Associate Editor: E. Suhir. 06 August 2002 12 12 2002 photonic switching systems soldering seals (stoppers) thermal analysis materials handling creep stress analysis finite element analysis fatigue testing tin alloys indium alloys thermal stress cracking packaging...
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Topics: Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis
Journal Articles

Solders and Soldering

Howard H. Manko,, Author, Anthony J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
DOI: https://doi.org/10.1115/1.1503063
Published Online: July 26, 2002
..., New York, NY, 2001, 519 pp., $79.95, ISBN: 0 07 134417 9 soldering lead materials properties bismuth alloys silver alloys indium alloys surface cleaning 2002 ASME ...
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Topics: Soldering, Solders, Alloys, Materials properties