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Keywords: indium alloys
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Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
Published Online: March 21, 2005
... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...
Journal Articles
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
Published Online: December 12, 2002
.... Associate Editor: E. Suhir. 06 August 2002 12 12 2002 photonic switching systems soldering seals (stoppers) thermal analysis materials handling creep stress analysis finite element analysis fatigue testing tin alloys indium alloys thermal stress cracking packaging...
Journal Articles
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
Published Online: July 26, 2002
..., New York, NY, 2001, 519 pp., $79.95, ISBN: 0 07 134417 9 soldering lead materials properties bismuth alloys silver alloys indium alloys surface cleaning 2002 ASME ...