...Ercan M. Dede; Feng Zhou; Yuqing Zhou; Danny J. Lohan; Mehdi Asheghi; Kenneth E. Goodson; Kris Erickson Heterogeneous integration of electronics is critical to the next wave of electronics applications ranging from extremely power dense energy conversion systems to advanced chiplet and copackaged...

.... The heterogeneous integration of chiplets often requires die-to-wafer hybrid bonding for diverse chip stacking architectures. This overview emphasis on some main issues associated with hybrid bonding extending to die-to-wafer level. The hybrid bond pad structure design is a critical factor affecting sensitivity...