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Keywords: heat sinks
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
Published Online: September 15, 2021
... be strongly enhanced by subsequent work hardening in mild cycling. e-mail:  sthekku1@binghamton.edu 12 04 2021 30 06 2021 15 09 2021 microjoints heat sinks copper nanoparticles rapid sintering porosity particle size macroscopic strain inelastic deformation impression creep...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041002.
Published Online: December 8, 2011
... power electronics, and space systems. This paper addresses (a) the implementation of two-phase microchannel heat sinks in these applications, (b) the fluid physics and limitations of boiling in small passages, and effective tools for predicting the thermal performance of heat sinks, and (c) means...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... strategies in data centers. Finally, the impact of heat sink thermal resistance is considered, and the potential data center efficiency gains from improved heat sink designs are discussed. © 2010 IEEE. Reprinted with permission from the “12th IEEE Intersociety Conference on Thermal and Thermomechanical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011001.
Published Online: March 2, 2011
...Tannaz Harirchian; Suresh V. Garimella Flow boiling in microchannels has been investigated extensively over the past decade for electronics cooling applications; however, the implementation of microchannel heat sinks operating in the two-phase regime in practical applications has lagged due...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031004.
Published Online: June 23, 2009
... areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
Published Online: April 3, 2009
...Mustapha Faraji; Hamid El Qarnia The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) (n-eicosane...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
...Christopher T. DeGroot; Anthony G. Straatman; Lee J. Betchen A numerical study has been undertaken to explore the details of forced convection heat transfer in finned aluminum foam heat sinks. Calculations are made using a finite-volume computational fluid dynamics (CFD) code that solves...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
Published Online: February 11, 2009
... between a spreader and heat source is less than 0.2. Even so, the thermal resistance corresponding to the predicted thickness is still in good agreement with the analytical solution. The proposed approximation will be useful for practical thermal design of heat sinks by predetermining the spreader...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041108.
Published Online: November 14, 2008
...Wataru Nakayama This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2008, 130(3): 034501.
Published Online: August 8, 2008
...Z. Q. Lou; C. Yap; A. S. Mujumdar Impinging jet heat transfer is a promising method to cool electronic components. In this paper, a numerical study has been carried out to examine the conjugate heat transfer under a confined impinging jet using a plate-fin heat sink as the target plate. Effects...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
... management more challenging, but IPEMs also offer the opportunity to extract heat from both the top and the bottom side of the module, enabling double-sided cooling. Although double-sided cooling of IPEMs can be implemented using traditional aluminum heat sinks, microchannels offer much higher heat transfer...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
Published Online: April 25, 2008
...K. Lafdi; O. Mesalhy; A. Elgafy In the present work, the potential of using foam structures impregnated with phase change materials (PCMs) as heat sinks for cooling of electronic devices has been numerically studied. Different design parameters have been investigated such as foam properties...