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Keywords: heat radiation
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 370–379.
Published Online: December 24, 2005
... silicon-based heat spreaders. 23 05 2005 24 12 2005 electronics packaging heat sinks surface roughness natural convection thermal resistance heat radiation nominally flat silicon-based heat spreader natural convection Grashof number Nusselt number external thermal...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 14–21.
Published Online: April 30, 2004
... management (packaging) natural convection heat conduction heat radiation heat losses The ever-increasing thermal demands of electronic devices are necessitating the consideration of thermal issues in the up-front board layout process. One application currently presenting a significant thermal...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 107–114.
Published Online: October 1, 1999
... of a single Tape Ball Grid Array (TBGA) package on a card. thermal management (packaging) ball grid arrays plastic packaging thermal resistance natural convection heat radiation turbulence heat sinks temperature distribution computational fluid dynamics 01 April 1998 01 Oct...