1-4 of 4
Keywords: heat radiation
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Available to Purchase
Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 370–379.
https://doi.org/10.1115/1.2351902
Published Online: December 24, 2005
... silicon-based heat spreaders. 23 05 2005 24 12 2005 electronics packaging heat sinks surface roughness natural convection thermal resistance heat radiation nominally flat silicon-based heat spreader natural convection Grashof number Nusselt number external thermal...
View Articletitled, Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders
Open the PDF for Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders in another window
Topics: Flat heat pipes, Silicon, Surface roughness, Thermal resistance, Natural convection, Heat transfer, Heat
Journal Articles

Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board

Available to Purchase
Randy D. Weinstein, Amy S. Fleischer, Kimberly A. Krug
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 14–21.
https://doi.org/10.1115/1.1635393
Published Online: April 30, 2004
... management (packaging) natural convection heat conduction heat radiation heat losses The ever-increasing thermal demands of electronic devices are necessitating the consideration of thermal issues in the up-front board layout process. One application currently presenting a significant thermal...
View Articletitled, Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board
Open the PDF for Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board in another window
Topics: Energy dissipation, Heat, Heat conduction, Natural convection, Printed circuit boards, Temperature, Copper
Journal Articles

Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging

Available to Purchase
Suman Chakraborty, Pradip Dutta, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 126–133.
https://doi.org/10.1115/1.1535445
Published Online: March 14, 2003
.... packaging cooling melting solidification freezing heat conduction convection heat radiation temperature distribution 23 January 2002 14 03 2003 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript...
View Articletitled, Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging
Open the PDF for Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging in another window
Topics: Freezing, Heat transfer, Melting, Packaging, Solidification, Temperature distribution, Phase change materials, Convection
Journal Articles

A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Available to Purchase
Sanjeev B. Sathe, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 107–114.
https://doi.org/10.1115/1.483141
Published Online: October 1, 1999
... of a single Tape Ball Grid Array (TBGA) package on a card. thermal management (packaging) ball grid arrays plastic packaging thermal resistance natural convection heat radiation turbulence heat sinks temperature distribution computational fluid dynamics 01 April 1998 01 Oct...
View Articletitled, A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
Open the PDF for A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package in another window
Topics: Ball-Grid-Array packaging, Heat sinks, Heat transfer, Junctions, Modeling, Natural convection, Radiation (Physics), Solders, Temperature, Thermal conductivity